Help Center

ABIS helps customers choose PCB types based on application environment, circuit complexity, signal speed, thermal requirements, mechanical structure, production quantity, and reliability expectations.

For simple electronic products, double-sided PCB or standard rigid PCB is often suitable when the design does not require high-density routing, controlled impedance, or complex stack-up.

Multilayer PCB is suitable when the circuit requires higher routing density, better signal integrity, power and ground layer control, smaller product size, or more stable electrical performance.

HDI PCB is suitable when the product needs finer lines, smaller vias, higher component density, compact size, and advanced signal routing.

For compact electronics, HDI PCB, flexible PCB, or rigid-flex PCB may be more suitable than standard rigid PCB. These PCB products help reduce board size, improve internal layout flexibility.

Multilayer PCB stack-up affects impedance control, signal integrity, power distribution, EMI performance, mechanical stability, and manufacturing reliability.

Yes. ABIS manufactures multilayer PCBs for industrial equipment, medical electronics, communication systems, automotive electronics, and OEM electronic products.

HDI PCB is commonly used in compact electronic products that require high-density routing, microvias, fine lines, fine spacing, small components, and stable electrical performance.

HDI PCB uses finer traces, smaller vias, microvia structures, and higher routing density to fit more circuits into a smaller board area. This helps product developers reduce device size, simplify internal layout, and support compact electronic product design.

Before HDI PCB manufacturing, customers should confirm microvia design, line width, spacing, stack-up, dielectric thickness, copper thickness, via-in-pad requirements, impedance control, material selection, and surface finish.

HDI PCB usually costs more than standard multilayer PCB because it may require finer manufacturing processes, laser drilling, tighter tolerances, advanced stack-up, and more complex inspection.

Flexible PCB is suitable when the product requires bending, lightweight structure, compact assembly, repeated movement, or space-saving interconnection.

Flexible PCB can help reduce wiring complexity, save internal space, lower assembly weight, improve layout flexibility, and replace some traditional cable connections.

Customers should consider bending radius, copper thickness, polyimide material, stiffener position, adhesive structure, coverlay design, surface finish, connector area, and dynamic or static bending requirements.

Rigid-flex PCB is better when the product needs compact structure, fewer connectors, improved reliability, and stable interconnection between multiple board areas.

Rigid-flex PCB production requires review of stack-up, bend area, rigid-to-flex transition, copper layout, material combination, coverlay, stiffener, board thickness, and assembly requirements.

Metal core PCB transfers heat away from heat-generating components through a metal base, thermal dielectric layer, and copper circuit layer.

Aluminum PCB is often selected when standard FR4 PCB cannot provide enough heat dissipation. It is suitable for LED products, power converters, lighting systems, industrial controllers, automotive electronics.

Customers should confirm thermal conductivity, aluminum thickness, copper thickness, dielectric material, surface finish, solder mask, operating temperature, power load, and mechanical structure.

Controlled impedance is often required for high-speed PCB, RF PCB, communication PCB, multilayer PCB, HDI PCB, and electronic products with strict signal transmission requirements.

ABIS can support controlled impedance PCB through stack-up review, dielectric thickness control, trace width calculation, material selection, copper thickness confirmation, and impedance testing.

Customers should provide Gerber files, stack-up requirements, impedance value, tolerance, signal layer, reference layer, material type, board thickness, copper thickness, and testing requirements.

High-Tg PCB material is recommended for products exposed to higher operating temperatures, lead-free assembly, thermal stress, or reliability-sensitive environments.

Key details include material type, board thickness, copper thickness, solder mask, surface finish, stack-up, impedance requirements, hole size, tolerances, testing standards, and production notes.

The right PCB product can improve thermal performance, mechanical strength, signal stability, and long-term reliability.