'ikamu NO.:
ABIS-ALU-002Papahana:
1Material:
Kumu AluminumMānoanoa Papa Hoʻopau:
0.5mmKa mānoanoa keleawe i pau:
1ozMin Laina Laulā/Lua:
≥3mil(0.075mm)Min Hole:
≥4mil(0.1mm)Ili Pau:
HASL-FreeWaihoʻoluʻu Palekana Solder:
Keʻokeʻokala kala:
ʻeleʻeleNoi:
Na Hale Hana HanaUa hana ʻo ABIS i nā PCB alumini no nā makahiki.ʻO kā mākou hiʻohiʻona piha alumini kaapuni
hiki iā ʻoe ke kiʻi i nā PCB alumini kiʻekiʻe i loko o ka waihona kālā.
Nā pōmaikaʻi o ABIS Nā PCB Aluminum
Aluminum PCBs Introduction
-Wehewehe
Aluminum ʻO ke kumu he CCL, he ʻano mea kumu o nā PCB.kaapuni pcb lako mana he mea hoohuihui i hakuia ʻO ka pahu keleawe, kahi papa dielectric, kahi papa kumu alumini a me ka membrane kumu alumini me a hoʻopau wela maikaʻi. Ke hoʻohana nei i kahi ʻāpana lahilahi o ka dielectric conductive thermally akā insulating uila, i laminated ma waena o ke kumu metala a me ka papa keleawe.Hoʻolālā ʻia ke kumu metala e huki i ka wela mai ke kaapuni ma o ka dielectric lahilahi.
-Pono
ʻO ABIS Metal Core PCB ka mana hana
'ikamu | Speci. |
Nā ʻāpana | 1~2 |
Mānoanoa Papa Hoʻopau Maʻamau |
0.3-5mm |
Mea waiwai | Kumu Aluminum, Kumu keleawe |
Nui Nui o ka Panel |
1200mm*560mm(47in*22in) |
Min Hole Nui | 12mil(0.3mm) |
Min Laina Laulā/Lua | 3mil(0.075mm) |
Mānoanoa Copper Foil |
35μm-210 μm (1oz-6oz) |
Mānoanoa keleawe maʻamau |
18 μm , 35 μm , 70 μm , 105 μm . |
Noho Mānoanoa Hoʻomanawanui | +/-0.1mm |
Alanui Outline tolerance | +/-0.15mm |
Kuʻi ʻana i ka hoʻomanawanui | +/-0.1mm |
ʻAno Māka Solder | LPI (kiʻi kiʻi wai) |
Mini.Hoʻomaʻemaʻe Palekana Solder | 0.05mm |
Anawaena Puka Puka | 0.25mm--0.60mm |
Ka hoʻomanawanui impedance | +/-10% |
Hoʻopau ʻili | Alakaʻi manuahi HASL, gula immersion (ENIG), sliver immersion, OSP, etc |
Palekana Solder | Kuʻuna |
Silkscreen | Kuʻuna |
MC PCB Hoʻokuʻu ʻia | 10,000 sqm / mahina |
ABIS Nā PCB Aluminum Ka manawa o waena o ka hoʻomaka a i ka wā pau
E like me ke kumu nui o kēia manawa, hana mākou i ka PCB alumini hoʻokahi, ʻoiai ʻoi aku ka paʻakikī o ka hana ʻana i ka PCB alumini ʻelua ʻaoʻao.
Volume Puʻupuʻu Liʻiliʻi ≤1 mika mika | Nā lā hana | Nuipa? iecaianoaaiiuo >1 sq mika | Nā lā hana |
ʻaoʻao hoʻokahi | 3-4 mau lā | ʻaoʻao hoʻokahi | 2-4 pule |
ʻaoʻao ʻelua | 6-7 mau lā | ʻaoʻao ʻelua | 2.5-5 pule |
ʻĀpana ʻenehana
ʻAʻOLE | Mea ho'āʻo | Noi ʻenehana | Unite | Hoao hou sult | |
1 | Peel Ka ikaika | A | ≥ 1.0 | N/mm | 1.05 |
Ma hope o ke kaumaha wela (260 ordm;C) | ≥ 1.0 | N/mm | 1.05 | ||
2 | ʻO ka hoʻāʻo ʻana ma hope o ke koʻikoʻi Thermal (288 ordm; C, 2min) | 288ordm;C 2 min ʻAʻohe delaminating | / | OK | |
3 | Kū'ē Themal | ≤ 2.0 | ordm;C /W | 0.65 | |
4 | Hiki ke ʻā (A) | FV-O | / | FV-O | |
5 | Palekana ʻili | A | ≥ 1 × 10 5 | M Ω | 5.0 × 10 7 |
Hoʻomaʻamaʻa haʻahaʻa mau (90%,3 5 ordm;C ,96h) | ≥ 1 × 10 5 | M Ω | 4.5 × 10 6 | ||
6 | Kū'ē Volume | A | ≥ 1 × 10 6 | M Ω· m | 1.0 × 10 8 |
Hoʻomaʻamaʻa haʻahaʻa mau (90%, 35 ordm; C ,96h) | ≥ 1 × 10 6 | M Ω· m | 1.9 × 10 7 | ||
7 | Hoʻokaʻawale Dielectric (DC) | ≥ 25 | Kv/mm | 31 | |
8 | Mau dielectric (1MHz) (40 ordm;C, 93% , 96h) | ≤ 4.4 | / | 4.2 | |
9 | Mea hoʻoheheʻe dielectric (1MHz) (40ordm; C ,93%,96h) | ≤ 0.03 | / | 0.029 | |
10 | Hoʻokolohua ʻelemakule wikiwiki (125 ordm; C ,2000h) | / | ʻAʻole pono ke kumu laminate i nā wrinkles, ʻaʻohe māwae, ʻaʻohe delaminating a ʻaʻohe pine | / | OK |
11 | Ho'āʻo hopena wela haʻahaʻa kiʻekiʻe (-50 ordm; C , 15min, 80ordm; C , 15min TOTAL DO 15 ~ 20 Circulation) | Ikaika Ihi | / | N/mm | 1.39 ~ 1.64 |
Palekana ʻili | / | M Ω | 1.9 × 10 8 ~6.4 × 10 8 |
Pehea ka hana ʻana o ABIS i nā pilikia o ka hana ʻana o ka Aluminum P CB?
Puke a me ka lawe ʻana
ʻAʻole hoʻāʻo wale ʻo ABIS CIRCUITS Company e hāʻawi i nā mea kūʻai aku i kahi huahana maikaʻi, akā e hoʻolohe pū i ka hāʻawi ʻana i kahi pūʻolo piha a palekana. Eia kekahi, hoʻomākaukau mākou i kekahi mau lawelawe pilikino no nā kauoha āpau.
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