'ikamu NO.:
Na Hana Hui PCBNĀ KULA:
Hana ʻia me ka mea kūʻai aku ʻo Gerber File & BOMHoʻolauna ʻia nā papahana PCBA
Hāʻawi ʻo ABIS CIRCUITS Company i nā lawelawe, ʻaʻole nā huahana wale nō.Hāʻawi mākou i nā hāʻina, ʻaʻole wale i nā waiwai.
Mai ka hana ʻana o ka PCB, ʻo nā mea kūʻai aku i nā ʻāpana e ʻākoakoa.Aia pū me:
ʻO kā mākou pono
Hāʻawi mākou i kahi lawelawe EMS hulina piha i nā mea kūʻai aku e makemake iā mākou e hōʻuluʻulu i ka PCB i PCBA, me nā prototypes, papahana NPI, ka leo liʻiliʻi a me ka liʻiliʻi.Hiki iā mākou ke hoʻopuka i nā mea āpau no kāu papahana hui PCB.Loaʻa i kā mākou poʻe ʻenekinia a me kā mākou pūʻulu sourcing ka ʻike waiwai i ke kaulahao lako a me ka ʻoihana EMS, me ka ʻike hohonu i ka hui SMT e hiki ai ke hoʻoholo i nā pilikia hana āpau.ʻO kā mākou lawelawe he kumu kūʻai, maʻalahi, a hilinaʻi.Ua ʻoluʻolu mākou i nā mea kūʻai aku ma nā ʻoihana he nui e pili ana i ka lāʻau lapaʻau, ʻoihana, automotive a me nā mea hoʻohana uila.
PCBA hiki
1 | ʻO ka hui SMT me ka hui BGA |
2 | Nā ʻāpana SMD i ʻae ʻia: 0204, BGA, QFP, QFN, TSOP |
3 | Kiʻekiʻe o ka mea: 0.2-25mm |
4 | ʻO ka pahu liʻiliʻi: 0204 |
5 | Min mamao ma waena o BGA: 0.25-2.0mm |
6 | Min BGA nui: 0.1-0.63mm |
7 | Min QFP wahi: 0.35mm |
8 | Ka nui hui min: (X*Y): 50*30mm |
9 | Ka nui hui nui: (X*Y): 350*550mm |
10 | ʻO ka pololei koho koho: ± 0.01mm |
11 | Hiki ke hoʻokomo: 0805, 0603, 0402 |
12 | Loaʻa ke kūpono paʻi helu pine kiʻekiʻe |
13 | Ka mana SMT i kēlā me kēia lā: 80,000 mau helu |
- - Hiki - SMT
Laina | 9(5 Yamaha,4KME) |
Ka hiki | 52 miliona mau wahi i kēlā me kēia mahina |
Nui Papa Nui | 457*356mm.(18”X14”) |
Min Nui o ka mea | 0201-54 sq.mm.(0.084 sq.inch), hoʻohui lōʻihi, CSP,BGA,QFP |
Ka māmā holo | 0.15 sec/chip,0.7 sec/QFP |
Laina | 2 |
Ka laula o ka papa | 400 mm |
ʻAno | ʻAle pālua |
Kūlana Pbs | Kākoʻo laina alakaʻi ʻole |
ʻO ka mahana kiʻekiʻe | 399 degere C |
Kapu ʻana | mea hoʻohui |
Wela mua | 3 |
Nā Kaʻina Hana Hana
Loaʻa i nā mea → IQC → Kūʻai → Mea i SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Hoʻouka Laina → Hoʻopaʻa ʻia ma o ka Hole → Wave Soldering → Hoʻopā i luna → 100% Nānā Kiʻi → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packaging → OQC Sampling → Shipping
Ka Mana Mana
Hoao AOI | Ke nānā nei no ka paʻi solder Nānā i nā ʻāpana a hiki i 0201 E nānā i nā ʻāpana nalo, offset, nā ʻāpana hewa, polarity |
Nānā X-Ray | Hāʻawi ʻo X-Ray i ka nānā hoʻonā kiʻekiʻe o: Nā BGA/Micro BGAs/Nā pūʻolo pālākiō chip / Nā papa ʻole |
Hoao Kaapuni | Hoʻohana maʻamau ka hoʻāʻo ʻana i loko o ka pōʻai me AOI e hōʻemi ana i nā hemahema hana i hoʻokumu ʻia e nā pilikia ʻāpana. |
Ho'āʻo mana | Ho'āʻo hana kiʻekiʻe Ka polokalamu polokalamu uila Hoao hana |
Palapala noi
Puke a me ka lawe ʻana
ʻAʻole hoʻāʻo wale ʻo ABIS CIRCUITS Company e hāʻawi i nā mea kūʻai aku i kahi huahana maikaʻi, akā e hoʻolohe pū i ka hāʻawi ʻana i kahi pūʻolo piha a palekana.Eia kekahi, hoʻomākaukau mākou i kekahi mau lawelawe pilikino no nā kauoha āpau.
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Mua:
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