'ikamu NO.:
ABIS-FR4-003Papahana:
4Material:
FR-4Mānoanoa Papa Hoʻopau:
1.0mmKa mānoanoa keleawe i pau:
1ozMin Laina Laulā/Lua:
≥3mil(0.075mm)Min Hole:
≥4mil(0.1mm)Ili Pau:
BGA ENIGWaihoʻoluʻu Palekana Solder:
ʻōmaʻomaʻokala kala:
KeʻokeʻoENIG Pahu-nui FR4 PCB Hoʻolauna
--Wehewehe
ʻO FR ke ʻano o ka "pale-ahi," ʻo FR-4 (a i ʻole FR4) kahi papa inoa NEMA no nā mea laminate epoxy i hoʻoikaika ʻia i ke aniani, kahi mea i haku ʻia me i ulana lole fiberglass me ka epoxy resin binder ʻo ia ka substrate kūpono no nā mea uila ma ka papa kaapuni paʻi.
- ʻO nā pono a me nā pōʻino o FR4 PCB
- Hoʻolālā PCB papa nui
Hoʻonui hou ka Multilayer PCB i ka paʻakikī a me ka nui o nā hoʻolālā PCB ma o ka hoʻohui ʻana i nā papa ʻē aʻe ma mua o nā papa luna a me lalo i ʻike ʻia i nā papa ʻaoʻao ʻelua. Kūkulu ʻia nā PCB multilayer e ka laminating i nā papa like ʻole.ʻO ka ʻO nā papa i loko, nā papa kaapuni ʻaoʻao ʻelua maʻamau, hoʻopaʻa pū ʻia, me nā papa insulating ma waena a ma waena o ke keleawe-foil no nā papa-waho.ʻO nā puka i wili ʻia ma ka papa (vias) e hoʻopili ai me nā papa like ʻole o ka papa.
ʻO nā mea maikaʻi a me nā pōʻino o Ka Immersion Nickel Uila ʻole (ENIG)
E ʻO NIG ka he ʻāpana metala ʻelua, me ka nickel e hana ana ma ke ʻano he pale i ke keleawe a me ka ʻili kahi i kūʻai ʻia ai nā ʻāpana.Mālama kahi papa gula i ka nickel i ka wā e mālama ai.
Pono:
Cons:
No hea mai ka mea resin ma ABIS?
ʻO ka hapa nui o lākou mai Shengyi Technology Co., Ltd. (SYTECH), ʻo ia ka lua o ka mea hana CCL nui loa o ka honua e pili ana i ka nui o ke kūʻai aku, mai 2013 a 2017. Ua hoʻokumu mākou i nā pilina lōʻihi o ka launa pū ʻana. mai 2006. ʻO ka mea resin FR4 ( Hoʻohālike S1000-2, S1141, S1165, S1600 ) hoʻohana nui ʻia no ka hana ʻana i nā papa kaapuni paʻi hoʻokahi a me nā ʻaoʻao ʻelua a me nā papa multi-layer.Eia nā kikoʻī no kāu kuhikuhi.
ʻOi aku ka mana hana PCB
Ua ʻike ʻo ABIS i ka hana ʻana i nā mea kūikawā no ka PCB paʻa, e like me: CEM-1/CEM-3, PI, Tg Kiʻekiʻe, Rogers, PTEF, Alu/Cu Base , etc. Aia ma lalo iho kahi ʻike pōkole FYI.
'ikamu | Speci. |
Nā ʻāpana | 1~20 |
Mānoanoa Papa | 0.1mm-8.0mm |
Mea waiwai | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. |
Nui Nui o ka Panel | 600mm×1200mm |
Min Hole Nui | 0.1mm |
Min Laina Laulā/Lua | 3mil(0.075mm) |
Papa Outline tolerance | 士0.10mm |
Mānoanoa Layer Insulation | 0.075mm--5.00mm |
Ka Manoanoa keleawe o waho | 18um--350um |
Luwaha wili (Mechanical) | 17um--175um |
Hole Hoʻopau (Mechanical) | 0.10mm--6.30mm |
ʻO ka hoʻomanawanui ʻana (Mechanical) | 0.05mm |
Kakau inoa (Mechanical) | 0.075mm |
ʻAspect Ratio | 16:1 |
ʻAno Māka Solder | LPI |
SMT Mini.Laulā Māka Solder | 0.075mm |
Mini.Hoʻomaʻemaʻe Palekana Solder | 0.05mm |
Anawaena Puka Puka | 0.25mm--0.60mm |
Ka hoʻomanawanui impedance | 士10% |
Hoʻopau ʻili | ENIG, OSP, HASL, Chem.Tin/Sn, gula Flash |
Soldermask | ʻOmaomao/melemele/ʻeleʻele/keʻokeʻo/ʻulaʻula/uliuli |
Silkscreen | ʻulaʻula/melemele/ʻeleʻele/keʻokeʻo |
Palapala | UL, ISO 9001, ISO14001, IATF16949 |
Noi Kuikawa | Puka makapō, manamana gula, BGA, ʻīnika kalapona, pale maka nānā, kaʻina VIP, ka uhi ʻaoʻao, ʻAlua lua |
Mea Hoolako Mea | Shengyi, ITEQ, Taiyo, etc. |
Pūʻolo maʻamau | Māmā + Kāpena |
Ke Kaʻina Hana Hana PCB-nui
- Hoʻomaka ke kaʻina hana me ka hoʻolālā ʻana i ka Layout o ka PCB me ka hoʻohana ʻana i kekahi polokalamu hoʻolālā PCB / CAD Tool ( Proteus, Eagle, a i ʻole CAD ).
- ʻO ke koena o nā ʻanuʻu o ka Hana Hana ʻana o kahi Papa Kaapuni Paʻi Paʻi ʻia e like me ka PCB ʻaoʻao hoʻokahi a i ʻole PCB ʻaoʻao ʻelua a i ʻole PCB multi-layer.
ʻO ka PCB papa-nui Ka manawa o waena o ka hoʻomaka a i ka wā pau
Māhele | Q/T Ke alakai manawa | Manawa alakai maʻamau | Nuipa? iecaianoaaiiuo | |||
ʻaoʻao ʻelua | 24 hola | 3-4 mau lā hana | 8-15 mau lā hana | |||
4 Papahana | 48 hola | 3-5 mau lā hana | 10-15 mau lā hana | |||
6 Papahana | 72 hola | 3-6 mau lā hana | 10-15 mau lā hana | |||
8 Papahana | 96 hola | 3-7 mau lā hana | 14-18 mau lā hana | |||
10 Papa | 120 hola | 3-8 mau lā hana | 14-18 mau lā hana | |||
12 Papa | 120 hola | 3-9 mau lā hana | 20-26 mau lā hana | |||
14 Papahana | 144 hola | 3-10 mau lā hana | 20-26 mau lā hana | |||
16-20 Papa | Ma muli o nā koi kiko'ī | |||||
20+ Papa | Ma muli o nā koi kiko'ī |
- Hoomakaukau Puka
Ke wehe pono nei i ka ʻōpala a me ka hoʻoponopono ʻana i nā ʻāpana mīkini drill: ma mua o ka hoʻopaʻa ʻia ʻana me ke keleawe, e nānā nui ka abis i nā puka āpau ma kahi fr4 pcb i mālama ʻia e wehe i nā ʻōpala, nā hewa ʻole o ka ʻili, a me ka epoxy smear. .no hoi, i ka hoomaka ana o ke kaʻina hana, drill machine parameter ua hoʻoponopono pololei.
- S Ka hoʻomākaukau ʻana o ka urface
Hoʻopau me ke akahele: e ʻike mua kā mākou poʻe ʻenehana loea ʻo ke ala wale nō e pale aku ai i kahi hopena maikaʻi ʻole ʻo ka manaʻo ʻana i ka pono o ka lawelawe kūikawā a me ka hana ʻana i nā hana kūpono e hōʻoia i ka hana pono a me ka pololei.
- Ua ʻōlelo ʻo T Nā Uku Hoʻonui Hermal
Maʻa i ka hana ʻana i nā mea like ʻole, hiki i ka abis ke nānā i ka hui ʻana e hōʻoia i ke kūpono.a laila mālama i ka hilinaʻi lōʻihi o ka cte (coefficient of thermal expansion), me ka cte haʻahaʻa, ʻoi aku ka liʻiliʻi o ka pale ʻana i nā lua mai ka hoʻololi pinepine ʻana o ke keleawe e hoʻopili ai i nā pilina o loko.
- Ka hoʻonui ʻana
Hoʻonui ʻia ka mana ʻo Abis i ka circuitry e nā pākēneka i ʻike ʻia i ka kali ʻana i kēia nalowale i hiki ai i nā papa ke hoʻi i ko lākou mau ana i hoʻolālā ʻia ma hope o ka pau ʻana o ka pōʻai lamination.no hoi, ka hoʻohana 'ana i ka baseline scaling paipai 'ana i ka hui 'ana me i loko o ka hale helu kaʻina hana hoʻomalu 'ikepili, e dial-i ka unahiʻole mea e e kūlike i ka manawa i loko o kēlā wahi manufacturing.
- Mīkini
Ke hiki mai ka manawa e kūkulu ai i kāu pcb, e ʻike pono ʻoe e koho i nā lako kūpono a me ka ʻike e hana pono ai i ka hoʻāʻo mua.
Puke a me ka lawe ʻana
ʻAʻole hoʻāʻo wale ʻo ABIS CIRCUITS Company e hāʻawi i nā mea kūʻai aku i kahi huahana maikaʻi, akā e hoʻolohe pū i ka hāʻawi ʻana i kahi pūʻolo piha a palekana.Eia kekahi, hoʻomākaukau mākou i kekahi mau lawelawe pilikino no nā kauoha āpau.
-Paʻi maʻamau:
- Manaʻo hoʻouna:
ʻŌlelo Pāʻoihana
- ʻAe ʻia nā ʻōlelo hoʻouna
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Kuhikuhi mai ABIS
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Mua:
1OZ keleawe hoʻopau Multilayer hou loa polū solder mask HASL Kina FR4 papa kaapuni mea hoʻolako me UL ISO kūlana kūponoAʻe:
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