Ana amfani da gwajin TDR a halin yanzu a cikin PCB na masana'antun da'ira na baturi ( buga allon kewayawa ) Layukan sigina da gwajin hana na'urar. Akwai dalilai da yawa waɗanda ke shafar daidaiton gwajin TDR, galibi tunani, daidaitawa, zaɓin karatu, da sauransu. Tunani zai haifar da ɓatanci mai tsanani a cikin ƙimar gwajin guntun siginar PCB, musamman lokacin da ake amfani da Tip (bincike) don gwaji.Babu shakka, saboda TIP da wurin tuntuɓar layin siginar za su haifar da babban katsewar cikas, haifar da tunani faruwa, da haifar da maƙarƙashiya na layin siginar PCB don canzawa a kusa da kusan inci uku ko huɗu.
Hoto: ENIG immersion 4 Layer Blue solder masker FR4
Irin su layukan sigina masu ƙarewa ɗaya, layin sigina daban-daban, masu haɗawa, da sauransu. Irin wannan gwajin yana da buƙatu, wanda shine haɗawa tare da ainihin yanayin aikace-aikacen.Misali, ainihin tashin gefen layin siginar na siginar yana da kusan 300ps, sannan ya kamata a saita gefen tashin siginar bugun bugun TDR daidai da 300ps maimakon 30ps.Hagu da dama masu tasowa, in ba haka ba sakamakon gwajin na iya bambanta da ainihin aikace-aikacen. 
English en 
