• Disamba 08. 2021

Ana amfani da gwajin TDR a halin yanzu a cikin PCB na masana'antun da'ira na baturi (allon da'irar) da layukan sigina da gwajin hana na'urar.Akwai dalilai da yawa waɗanda ke shafar daidaiton gwajin TDR, galibi tunani, daidaitawa, zaɓin karatu, da dai sauransu. Tunani zai haifar da rarrabuwar kawuna a cikin ƙimar gwajin guntun siginar PCB, musamman lokacin da ake amfani da Tip (bincike) ...

• Nuwamba 03. 2022

1,铜箔基材CCL (FPC Copper Clad Laminate) Ya ƙunshi yadudduka uku na foil na jan karfe + manne + substrate.Bugu da kari, akwai kuma wadanda ba mannewa substrates, wato, hade da biyu yadudduka na jan karfe foil + substrate, wanda shi ne in mun gwada da tsada da kuma dace ga kayayyakin da bukatar fiye da 10W sau na lankwasawa rayuwa.1.1 Rubutun tagulla Game da kayan, an raba shi zuwa birgima ɗan sanda ...