Indlela yokuphepha ibhodi yesekethe eprintiweyo ukulwa

1. Ukunciphisa umphumo weqondo lokushisa kwixinzelelo lwebhodi
Ekubeni [ubushushu] bungumthombo oyintloko wokuxinzezeleka kwebhodi, ngokude nje ukuba ukushisa kwe-oven yokubuyisela kuyancipha okanye isantya sokufudumala kwebhodi kunye nokupholisa kwi-oven reflow iyancipha, i-warpage ye-PCB inokunciphisa kakhulu.Nangona kunjalo, ezinye iziphumo zecala zinokuthi zenzeke, ezifana ne-solder shorts.

2. Sebenzisa iphepha eliphezulu leTg
I-Tg yiqondo lokushisa lokutshintsha kweglasi, oko kukuthi, iqondo lokushisa apho izinto zitshintsha ukusuka kwiglasi ukuya kwimeko yerabha.Ixabiso eliphantsi le-Tg yezinto eziphathekayo, ngokukhawuleza ibhodi iqala ukuthambisa emva kokungena kwi-oven yokubuyisela, kunye nexesha elithathayo ukuba libe yimeko yerabha ethambileyo.Iya kuba nde, kwaye ukuguqulwa kwebhodi ngokuqinisekileyo kuya kuba nzima ngakumbi.Ukusetyenziswa kwephepha leTg eliphezulu kunokunyusa amandla ayo okumelana noxinzelelo kunye nokuguqulwa, kodwa ixabiso lezinto ezihambelanayo nazo ziphezulu.

3. Ukwandisa ubukhulu bebhodi yesekethe
Ukuze kuphunyezwe ubukhulu obulula kunye nobuncinci beemveliso ezininzi ze-elektroniki, ubukhulu bebhodi bushiywe kwi-1.0mm, 0.8mm, kunye ne-0.6mm.Ubukhulu obunjalo kufuneka bugcine ibhodi ingakhubazeki emva kokudlula kwisithando somlilo, into enzima ngokwenene.Umzi-mveliso we-PCB ucebisa ukuba ukuba akukho mfuneko yokukhanya kunye nokubhitya, ibhodi inokusebenzisa ubukhulu be-1.6mm ubukhulu, obunokunciphisa kakhulu umngcipheko we-warpage kunye nokuguqulwa kwebhodi ye-PCB.

4. Ukunciphisa ubungakanani bebhodi yesekethe kwaye unciphise inani leepaneli
Ekubeni ii-ovens ezininzi zokubuyisela kwakhona zisebenzisa amatyathanga ukuqhuba ibhodi yesekethe phambili, ibhodi yesekethe enkulu iya kuba ne-dented kwaye ikhubazeke kwi-oven yokubuyisela ngenxa yobunzima bayo, ngoko zama ukubeka icala elide lebhodi yesekethe njengomgca webhodi.Kwikhonkco lesithando somlilo, i-deformation ye-concave ebangelwa ubunzima bebhodi yesiphaluka ngokwayo ingancitshiswa.Esi sisizathu sokunciphisa inani leepaneli.Oko kukuthi, xa udlula isithando somlilo, zama ukusebenzisa icala elimxinwa ukuba libe yi-perpendicular ukuya kwicala lesithando somlilo, esinokufikelela kwi-lowest Ubuninzi be-concave deformation.

5. Sebenzisa i-oven tray fixture
Ukuba iindlela ezingentla zinzima ukufezekisa, into yokugqibela kukusebenzisa i-oven tray (i-reflow soldering carrier / template) ukunciphisa ukuguqulwa kwebhodi yesiphaluka.Umgaqo wokuba i-oven fixture fixture inokunciphisa i-warpage yebhodi ye-PCB kungenxa yokuba imathiriyeli ye-fixture ibanzi.I-aluminiyam ialloy okanye ilitye lokwenziwa liza kusetyenziselwa ukuxhathisa ubushushu obuphezulu, ngoko ke umzi-mveliso wePCB uya kuvumela ibhodi yesekethe ukuba idlule kwiqondo eliphezulu lokwanda kwe-thermal ye-oveni yokuqukuqela kunye nokushwabana okubandayo emva kokupholisa phantsi.I-tray inokudlala umsebenzi wokuzinzisa ibhodi yesiphaluka.Emva kokuba iqondo lokushisa leplate liphantsi kunexabiso le-Tg kwaye liqala ukubuyisela kunye nokuqina, ubungakanani bokuqala bunokugcinwa.

Ukuba i-tray ye-single-layer fixture ayikwazi ukunciphisa ukuguqulwa kwe ibhodi yesekethe , kufuneka udibanise umgca wekhava ukuze ubambe ibhodi yesiphaluka kunye neetreyi eziphezulu kunye nezantsi, ezinokunciphisa kakhulu ukuguqulwa kwebhodi yesiphaluka nge-oven reflow..Nangona kunjalo, le tray ye-oveni ibiza kakhulu, kwaye kuya kufuneka wongeze abasebenzi kwindawo kwaye uphinde uyisebenzise itreyi.

6. Sebenzisa i-Router endaweni ye-V-Cut's sub-board
Ekubeni i-V-Cut iya kutshabalalisa amandla okwakhiwa kwepaneli phakathi kweebhodi, zama ukungasebenzisi i-V-Cut sub-board, okanye ukunciphisa ubunzulu be-V-Cut.

Nawuphi na omnye umbuzo, nceda RFQ .