Iimpawu ezili-10 zokuthembeka okuphezulu kwePCB,
1. 20μm umngxuma eludongeni ubukhulu bobhedu Ibhodi yesekethe eprintiweyo ,
Iinzuzo: Ukuthembeka okuphuculweyo, kubandakanywa nokuphuculwa kokwandiswa kwe-z-axis. Imingcipheko yokungenzi njalo: ukuvuthela imingxuma okanye ukuphuma, imiba yoxhulumaniso lombane ngexesha lokudibanisa (ukwahlulwa kwamacandelo angaphakathi, ukuphulwa kweendonga zomngxuma), okanye ukungaphumeleli okunokwenzeka phantsi kweemeko zomthwalo ekusetyenzisweni kwangempela.
2. Akukho ukulungiswa kwe-welding okanye ukulungiswa kweesekethe ezivulekileyo Inzuzo: Isekethe egqibeleleyo iqinisekisa ukuthembeka kunye nokhuseleko, akukho kugcinwa, akukho mngcipheko. Umngcipheko wokungenzi oku: Ukuba ulungiswe ngokungalunganga, uya kudala isiphaluka esivulekileyo ebhodini.Nokuba kulungiswe 'ngokufanelekileyo', kukho umngcipheko wokusilela phantsi kweemeko zomthwalo (ukungcangcazela, njl.njl.) enokusilela ekusetyenzisweni kwangempela. 3. Sebenzisa i-CCL eyaziwayo kumazwe ngamazwe, Iinzuzo: Ukuthembeka okuphuculweyo, ixesha elide kunye nokusebenza okwaziwayo. Imingcipheko yokungenzi oku: Ukusebenzisa amaxwebhu asemgangathweni angaphantsi kuya kunciphisa kakhulu ubomi bemveliso, kwaye kwangaxeshanye, iipropathi ezihlwempuzekileyo zomatshini zeshiti zithetha ukuba ibhodi ayiyi kwenza njengoko kulindelwe phantsi kweemeko ezidibeneyo, umzekelo: ukwanda okuphezulu. iipropathi zinokukhokelela kwi-delamination, isekethe evulekileyo kunye neengxaki ze-warping buckling, kunye neepropathi ezibuthathaka zombane zinokukhokelela ekusebenzeni kakubi kwe-impedance. Iimathiriyeli zomzi-mveliso we-ABIS PCB zonke zivela kubanikezeli bebhodi abaziwayo basekhaya nabangaphandle, kwaye bafikelele kubudlelwane bentsebenziswano beqhinga bexesha elide nababoneleli ukuze kuzinziswe unikezelo. 4. Sebenzisa i-inki ekumgangatho ophezulu Iinzuzo: Qinisekisa umgangatho wokuprintwa kwebhodi yesekethe, uphucule ukuthembeka kokuveliswa komfanekiso, kunye nokukhusela isiphaluka. Umngcipheko wokungakwenzi oku: Ii-inki ezikumgangatho ophantsi zinokubangela ukubambelela, ukuxhathisa umkhuhlane kunye neengxaki zokuqina.Zonke ezi ngxaki zinokubangela ukuba imaski ye-solder ikhuphe ebhodini kwaye ekugqibeleni iholele kwi-corrosion yesekethe yethusi.Iipropati ze-insulation ezingalunganga zingabangela iisekethe ezimfutshane ngenxa yokuqhubekeka kombane ngengozi / i-arcing.
5. Ugqwesile kwiimfuno zococeko kwiinkcukacha ze-IPC Inzuzo: Ucoceko oluphuculweyo lwePCB luphucula ukuthembeka. Imingcipheko yokungenzi oku: Iintsalela ebhodini, i-solder build-up ingabonisa umngcipheko kwi-mask ye-solder, i-ionic i-ionic ingabangela ukubola kwendawo ye-solder kunye nomngcipheko wokungcoliseka okungakhokelela kwimiba yokuthembeka (amalungu amabi e-solder / ukusilela kombane. ), kwaye Ekugqibeleni kwandisa amathuba okuba nokusilela.
Imaski emhlophe yesolder yeAluminiyam yeSekethe yeBhodi
6. Lawula ngokungqongqo ubomi benkonzo yonyango lomphezulu ngamnye Iinzuzo: Ukuthengiswa, ukuthembeka, kunye nokunciphisa umngcipheko wokungena kokufuma. Imingcipheko yokungakwenzi oku: Imiba ye-Solderability inokuthi yenzeke ngenxa yotshintsho lwe-metallographic ekugqityweni komphezulu weebhodi ezindala, kunye nokungena kwamanzi kunokubangela i-delamination, iileya zangaphakathi kunye neendonga zomngxuma ngexesha lokudibanisa kunye / okanye ukusetyenziswa okwenyani Ukwahlula (isekethe evulekile), njl. inkqubo yokutshiza i-tin yomhlaba njengomzekelo, ubukhulu be-tin yokutshiza yi-≧1.5μm, kwaye ubomi benkonzo bude. 7. Umngxuma weplagi okumgangatho ophezulu Inzuzo: Imingxuma yeplagi ekumgangatho ophezulu kumzi-mveliso wePCB iya kunciphisa umngcipheko wokusilela ngexesha lokuhlanganisa. Umngcipheko wokungakwenzi oku: Iintsalela zemichiza ezivela kwinkqubo yokuntywiliselwa kwegolide zinokuhlala kwimingxunya engavalwanga ngokupheleleyo, nto leyo ebangela iingxaki ezinjengokuqina.Ukongeza, kusenokubakho amaso etoti afihlwe emingxunyeni.Ebudeni bendibano okanye yokwenene yokusetyenziswa, amaso enkcenkce anokugqabhuka aze abangele isiphaluka esifutshane. 8. Ukunyamezela i-CCL kuyahlangabezana neemfuno ze-IPC 4101 ClassB/L Inzuzo: Ulawulo oluluqilima lobungqimba bomaleko we-dielectric kunciphisa ukutenxa ekusebenzeni kombane okulindelekileyo. Umngcipheko wokungakwenzi oku: Ukusebenza kombane akunakuhlangabezana neemfuno ezichaziweyo, kwaye amacandelo akwibhetshi enye anokwahluka kakhulu kwimveliso/ukusebenza. 9. Lawula ngokungqongqo ukunyamezela kweemilo, imingxuma kunye nezinye iimpawu zomatshini Inzuzo: Ukunyamezela okulawulwa ngokuqinileyo kuphucula umgangatho wemveliso-ukuphucula ukufaneleka, ifom kunye nomsebenzi. Imingcipheko yokungenzi oku: Iingxaki ngexesha lendibano, ezifana nokulungelelaniswa/ukukhwelana (iingxaki ngezikhonkwane zokucinezela zifunyanwa kuphela xa indibano igqityiwe).Ukongeza, ukunyuswa kwisiseko nako kunokuba yingxaki ngenxa yokwanda kokunxaxha kwe-dimensional.Ngokwemigangatho ephezulu yokuthembeka, ukunyamezela indawo yomngxuma ingaphantsi okanye ilingana ne-0.075mm, ukunyamezela kwedayamitha yomngxuma yi-PTH ± 0.075mm, kunye nokunyamezela imilo yi-± 0.13mm. 10. Ubukhulu bemaski ye-solder bunzima ngokwaneleyo Iinzuzo: Iipropati eziphuculweyo zokugquma umbane, ukunciphisa umngcipheko wokukrazula okanye ukulahleka kokubambelela, ukunyuka kokumelana nokutshatyalaliswa komatshini - naphi na apho kwenzeka khona! Umngcipheko wokungakwenzi oku: Imaski ebhityileyo yesolder inokubangela ukuncamathelisa, ukuxhathisa umkhuhlane kunye neengxaki zobulukhuni.Zonke ezi ngxaki zinokubangela ukuba imaski ye-solder ikhuphe ebhodini kwaye ekugqibeleni iholele kwi-corrosion yesekethe yethusi.Iipropathi ezisezantsi zokugquma ngenxa yemaski ebhityileyo ye-solder, inokubangela iisekethe ezimfutshane ngenxa yokuqhuba ngengozi/i-arcing.
Abanye, nceda rfq, Apha!
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