ENIG FR4 Rigid Multi-layer Printed Circuit Board Manufacturing Supplier

FR4 PCB Introduction

--Definition

FR means “flame-retardant,” FR-4 (or FR4) is a NEMA grade designation for glass-reinforced epoxy laminate material, a composite material composed of woven fiberglass cloth with an epoxy resin binder that makes it an ideal substrate for electronic components on a printed circuit board.

-Pros and Cons of FR4 PCB

• FR-4 material is so popular because of its many wondrous qualities that can benefit printed circuit boards. In addition to being affordable and easy to work with, it is an electrical insulator with very high dielectric strength. Plus, it's durable, moisture-resistant, temperature-resistant and lightweight.

• FR-4 is a widely relevant material, popular mostly for its low cost and relative mechanical and electrical stability. While this material features extensive benefits and is available in a variety of thicknesses and sizes, it isn't the best choice for every application, especially high-frequency applications like RF and microwave designs. 

-Multi-layer PCB Structure

   Multilayer PCBs further increases the complexity and density of PCB designs by adding additional layers beyond the top and bottom layers seen in double sided boards. Multilayer PCBs are built by laminating the various layers. The inner-layers, normally double-sided circuit boards, are stacked together, with insulating layers in between and between the copper-foil for the outer-layers. Holes drilled through the board (vias) will make connections with the different layers of the board.

Where does the resin material come from in ABIS?

Most of them from Shengyi Technology Co., Ltd. (SYTECH), who has been the world's second largest CCL manufacturer in terms of sales volume, from 2013 to 2017. We established long-term relations of cooperation since 2006. The FR4 resin material (Model S1000-2, S1141, S1165, S1600) are mainly used for making single and double-sided printed circuit boards as well as multi-layer boards. Here comes details for your reference.

• For FR-4: Sheng Yi, King Board, Nan Ya, Polycard, ITEQ, ISOLA

• For CEM-1 & CEM 3: Sheng Yi, King Board

• For High Frequency : Sheng Yi

• For UV Cure:  Tamura, Chang Xing ( * Available colour : Green) Solder for Single Side

• For Liquid Photo: Tao Yang, Resist (Wet Film)

• Chuan Yu ( * Available colours : White, Imaginable Solder Yellow, Purple, Red, Blue, Green,  Black)

Rigid PCB Manufacturing Capacity

ABIS experienced in making special materials for rigid PCB, such as: CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. Below is a brief overview FYI.

Multi-layer PCB Manufacturing Process

• The process starts with designing Layout of the PCB using any PCB designing software / CAD Tool (Proteus, Eagle, Or CAD).

• All rest of the steps are of Manufacturing Process of a Rigid Printed Circuit Board is same as Single Sided PCB or Double Sided PCB or Multi-layer PCB.

Multi-layer PCB Lead Time

-Hole Preparation

Removing debris carefully & adjusting drill machine parameters: before plating through with copper, abis pays high attention to all holes on an fr4 pcb treated to remove debris, surface irregularities, and epoxy smear, the clean holes ensure the plating successfully adheres to the hole walls. also, early in the process, drill machine parameters are adjusted accurately.

- Surface Preparation

Deburring carefully: our experienced tech workers will be aware ahead of time that the only way to avoid a bad outcome is to anticipate the need for special handling and to take the appropriate steps to be sure that the process is done carefully and correctly.

-Thermal Expansion Rates

Accustomed to dealing with the various materials, abis will be able to analyze the combination to be sure that it is appropriate. then keeping the long-term reliability of the cte (coefficient of thermal expansion), with the lower cte, the less likely the plated through holes are to fail from repeated flexing of the copper which forms the internal layer interconnections.

-Scaling

Abis control the circuitry is scaled-up by known percentages in anticipation of this loss so that the layers will return to their as-designed dimensions after the lamination cycle is complete. also, using the laminate manufacturer’s baseline scaling recommendations in combination with in-house statistical process control data, to dial-in scale factors that will be consistent over time within that particular manufacturing environment.

 

-Machining

When the time comes to build your pcb, abis be sure that you choose has the right equipment and experience to produce it correctly on the first try.

Packaging & Delivery

ABIS CIRCUITS Company is not only trying to give customers a good product, but also pay attention to offering a complete and safe package. Also, we prepare some personalized services for all the orders.

-Common packaging:

• PCB:  Sealed bag, Anti-static bags, Suitable carton.
• PCBA:  Antistatic foam bags, Anti-static bags, Suitable carton.
• Customized Packaging: The carton outside will be printed the name of the customer address, mark, the customer needs to specify the destination and other information.

-Delivery Tips:

• For small package, we advise to choose byExpress or DDU service is the quickest way. 
• For heavy package, the best solution is by sea transportation.

Business Terms
-Accepted Delivery Terms
FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF

--Accepted Payment Currency
USD, EUR, CNY.

-Accepted Payment Type
T/T, PayPal, Western Union.

Quotation from ABIS

To ensure an accurate quote, be sure to include the following information for your project:

• Complete GERBER files including the BOM list
• Quantities
• Turn time
• Panelization Requirements
• Materials Requirements
• Finish requirements