Lenziwa kanjani ibhodi lesifunda lefekthri ye-PCB?Izinto ezincane zesekethe ezingabonwa phezulu ziyi-copper foil.Ekuqaleni, i-foil yethusi yayimbozwe kuyo yonke i-PCB, kodwa ingxenye yayo yaqoshwa ngesikhathi senqubo yokukhiqiza, futhi ingxenye esele yaba yisekethe encane efana ne-mesh..

 

Le migqa ibizwa ngokuthi izintambo noma amathrekhi futhi isetshenziselwa ukuhlinzeka ngoxhumano lukagesi ezingxenyeni eziku-PCB.Ngokuvamile umbala we Ibhodi le-PCB iluhlaza noma insundu, okuwumbala we-solder mask.Kuwungqimba oluvikelayo oluvikelayo oluvikela ucingo lwethusi futhi luphinde luvimbele izingxenye ukuthi zingadayiswa ezindaweni ezingalungile.



Multilayer Circuit board manje asetshenziswa kuma-motherboards namakhadi ezithombe, okwandisa kakhulu indawo engaxhunywa ngezintambo.Amabhodi amaningi asebenzisa okuningi amabhodi okufaka izintambo angawodwa noma anezinhlangothi ezimbili , futhi ubeke ungqimba oluvikelayo phakathi kwebhodi ngalinye bese uwacindezela ndawonye.Inani lezendlalelo zebhodi le-PCB lisho ukuthi kunezingqimba zezintambo ezimbalwa ezizimele, ngokuvamile inani lezendlalelo lilinganayo, futhi lihlanganisa izingqimba ezimbili ezingaphandle kakhulu.Amabhodi e-PCB avamile ngokuvamile ayizingqimba ezi-4 kuya kweziyisi-8 zesakhiwo.Inani lezendlalelo zamabhodi amaningi e-PCB lingabonwa ngokubuka ingxenye yebhodi le-PCB.Kodwa empeleni, akekho oneso elihle kangaka.Ngakho, nansi enye indlela yokukufundisa.

 

Uxhumano lwesekethe lwamabhodi anezingqimba eziningi lugqitshwa ngendlela futhi luyimpumputhe ngobuchwepheshe.Amabhodi omama amaningi namakhadi wokubonisa asebenzisa amabhodi e-PCB anezendlalelo ezi-4, kanti amanye asebenzisa amabhodi e-PCB angu-6-, 8-layer, noma ngisho ne-10-layer PCB.Uma ufuna ukubona ukuthi zingaki izendlalelo eziku-PCB, ungazikhomba ngokubheka izimbobo zomhlahlandlela, ngoba amabhodi anezingqimba ezi-4 asetshenziswa ebhodini elikhulu kanye nekhadi lokubonisa ayizingqimba zokuqala nezesine zezintambo, futhi ezinye izingqimba zisetshenziselwa ezinye izinjongo (ucingo oluphansi).namandla).

 

Ngakho-ke, njengebhodi elinezingqimba ezimbili, imbobo yomhlahlandlela izongena ebhodini le-PCB.Uma ezinye nge-vias zivela ohlangothini olungaphambili lwe-PCB kodwa zingatholakali ohlangothini olungemuva, kufanele kube ibhodi lesendlalelo esingu-6/8.Uma izimbobo zomhlahlandlela ezifanayo zingatholakala ezinhlangothini zombili zebhodi le-PCB, ngokwemvelo ibhodi elinezingqimba ezi-4.



Inqubo yokukhiqiza ye-PCB iqala "nge-substrate" ye-PCB eyenziwe nge-Glass Epoxy noma okufanayo.Isinyathelo sokuqala sokukhiqiza ukudweba izintambo phakathi kwezingxenye.Indlela "iwukuphrinta" i-negative yesekethe yebhodi lesekhethi ye-PCB eklanyelwe ku-conductor yensimbi ngokudluliswa kwe-Subtractive.



Iqhinga ukusabalalisa ungqimba oluncane lwe-foil yethusi phezu kwendawo yonke bese ususa okweqile.Uma ukukhiqizwa kukabili, izinhlangothi zombili ze-PCB substrate zizombozwa nge-foil yethusi.Ukwenza ibhodi elinezingqimba eziningi, amabhodi amabili anamaceleni amabili "angacindezelwa" kanye ne-adhesive ekhethekile.

 

Okulandelayo, ukubhoboza kanye ne-electroplating edingekayo ukuxhuma izingxenye kungenziwa ebhodini le-PCB.Ngemuva kokubhoboza ngemishini yomshini ngokuya ngezidingo zokubhoboza, ingaphakathi lodonga lwembobo kufanele libekwe (Plated-Through-Hole technology, PTH).Ngemuva kokuthi ukwelashwa kwensimbi kwenziwa ngaphakathi kodonga lwembobo, izingqimba zangaphakathi zamasekethe zingaxhunywa komunye nomunye.

 

Ngaphambi kokuqala i-electroplating, imfucumfucu emgodini kufanele ihlanzwe.Lokhu kungenxa yokuthi i-resin epoxy izoba nezinguquko ezithile zamakhemikhali lapho ishisisiwe, futhi izovala izendlalelo ze-PCB zangaphakathi, ngakho-ke idinga ukususwa kuqala.Zombili izenzo zokuhlanza nokucwenga zenziwa enqubweni yamakhemikhali.Okulandelayo, kuyadingeka ukugqoka i-solder ukumelana nopende (i-solder resist inki) ku-wiring yangaphandle ukuze i-wiring ingathinti ingxenye ehlanganisiwe.

 

Ngemva kwalokho, izingxenye ezihlukahlukene zinyatheliswa isikrini ebhodini lesifunda ukuze kuboniswe indawo yengxenye ngayinye.Ayikwazi ukumboza noma yiziphi izintambo noma iminwe yegolide, ngaphandle kwalokho ingase inciphise ukuthengiselana noma ukuzinza koxhumo lwamanje.Ngaphezu kwalokho, uma kukhona ukuxhumeka kwensimbi, "iminwe yegolide" ivame ukumbozwa ngegolide ngalesi sikhathi ukuze kuqinisekiswe uxhumano lukagesi olusezingeni eliphezulu lapho lufakwa ku-slot yokwandisa.

 

Ekugcineni, kukhona ukuhlolwa.Hlola i-PCB ukuze uthole izikhindi noma amasekhethi avuliwe, ngokubona noma ngogesi.Izindlela zokubona zisebenzisa ukuskena ukuze kutholwe amaphutha kusendlalelo ngasinye, futhi ukuhlola ngogesi kuvame ukusebenzisa i-Flying-Probe ukuhlola konke ukuxhumana.Ukuhlolwa kwe-elekthronikhi kunembe kakhulu ekutholeni izikhindi noma okuvulayo, kodwa ukuhlola kwe-optical kungathola kalula izinkinga ezinezikhala ezingalungile phakathi kwamakhondakta.



Ngemuva kokuthi i-substrate yebhodi lesifunda isiqediwe, i-motherboard eqediwe ifakwe izingxenye ezihlukahlukene zobukhulu obuhlukahlukene ku-substrate ye-PCB ngokwezidingo - okokuqala sebenzisa umshini wokubeka othomathikhi we-SMT ukuze "uthengise i-IC chip kanye nezingxenye ze-patch", bese uzenza ngesandla. xhuma.Xhuma omunye umsebenzi ongeke wenziwe umshini, futhi ulungise ngokuqinile lezi zingxenye ze-plug-in ku-PCB ngenqubo ye-wave/reflow soldering, ukuze kukhiqizwe i-motherboard.