1. Kungani i-BGA itholakala emgodini we-solder mask?Liyini izinga lokwamukela?
Re: Okokuqala, imbobo yepulaki yemaski ye-solder iwukuvikela impilo yesevisi ye-via, ngoba imbobo edingekayo endaweni ye-BGA ngokuvamile incane, phakathi kuka-0.2 no-0.35mm.Enye isiraphu akulula ukuba yomiswe noma ihwamuke, futhi kulula ukushiya izinsalela.Uma imaski ye-solder ingaplaki imbobo noma ipulaki ingagcwele, kuzoba nensalela yento yangaphandle noma ubuhlalu bethini ekucutshungulweni okulandelayo okufana nokufafaza ithini negolide lokucwiliswa.Ngokushesha nje lapho ikhasimende lishisa ingxenye ngesikhathi sokushisa okuphezulu, izinto zangaphandle noma ubuhlalu bethini emgodini buzophuma futhi bunamathele engxenyeni, okubangela ukukhubazeka ekusebenzeni kwengxenye, njengamasekhethi avulekile namafushane.I-BGA itholakala emgodini wemaski we-solder A, kufanele igcwale u-B, akukho ububomvu noma ukuchayeka kwethusi okungamanga okuvunyelwe, C, akugcwele kakhulu, futhi i-protrusion iphakeme kunephedi okufanele idayiswe eduze kwayo (okuzothinta Umphumela wokukhweza). 
2. Uyini umehluko phakathi kwengilazi ephezulu yetafula yomshini wokuchayeka kanye nengilazi evamile?Kungani isibonisi sesibani sokuchayeka singalingani? Re: Ingilazi yetafula yomshini wokuchayeka ngeke ikhiqize ukuphinda ukukhanya lapho ukukhanya kudlula kuyo.Uma isibonisi sesibani sokuchayeka siyisicaba futhi sibushelelezi, khona-ke lapho ukukhanya kukhanya kuso, ngokuvumelana nesimiso sokukhanya, sakha ukukhanya okukodwa okubonisiwe okukhanya ebhodini ukuze kuvezwe.Uma umgodi u-convex futhi ungalingani ngokuvumelana nokukhanya Isimiso siwukuthi ukukhanya okukhanya ezindaweni ezingemuva kanye nokukhanya okukhanyisa ama-protrusions kuyokwenza imisebe yokukhanya ehlakazekile engenakubalwa, yakhe ukukhanya okungavamile kodwa okufana ebhodini okuzodalulwa, kuthuthukise ukukhanya. umphumela wokuchayeka. 
3. Kuyini ukuthuthukiswa ohlangothini?Iyini imiphumela yekhwalithi ebangelwa ukuthuthukiswa okuhlangene? Re: Indawo yobubanzi ngaphansi kwengxenye lapho amafutha aluhlaza ohlangothini olulodwa lwefasitela lemaski ye-solder iye yathuthukiswa ibizwa ngokuthi ukuthuthukiswa ohlangothini.Uma ukuthuthukiswa ohlangothini kukhulu kakhulu, kusho ukuthi indawo yamafutha aluhlaza yengxenye ethuthukisiwe futhi ehlangene ne-substrate noma isikhumba sethusi inkulu, futhi izinga lokulenga elibunjwe yiyo likhulu.Ukucutshungulwa okulandelayo okufana nokufutha ngethayela, ukucwiliswa kwethini, Igolide lokucwiliswa kanye nezinye izingxenye ezikhulayo eziseceleni zihlaselwa izinga lokushisa eliphezulu, ukucindezela kanye nezinye izithako ezinolaka kuwoyela oluhlaza.Amafutha azokwehla.Uma kunebhuloho likawoyela eliluhlaza endaweni ye-IC, kuzobangelwa lapho ikhasimende lifaka izingxenye zokushisela.Izodala isifunda esifushane sebhuloho.
4. Kuyini ukuchayeka kwemaski ye-solder empofu?Izoyidala yiphi imiphumela yekhwalithi? Re: Ngemva kokucutshungulwa yinqubo ye-mask ye-solder, ivezwa kuma-pads wezingxenye noma izindawo ezidinga ukudayiswa ngenqubo yakamuva.Ngesikhathi sokuqondisa imaski ye-solder/inqubo yokuchayeka, kubangelwa isithiyo sokukhanya noma amandla okuchayeka kanye nezinkinga zokusebenza.Ingaphandle noma wonke amafutha aluhlaza ambozwe yile ngxenye avezwa ekukhanyeni ukuze kubangele ukusabela kokuxhumanisa.Ngesikhathi sokuthuthukiswa, amafutha aluhlaza kule ngxenye ngeke ahlakazwe yisisombululo, futhi ingaphandle noma yonke i-pad ezothengiswa ayikwazi ukudalulwa.Lokhu kubizwa ngokuthi i-soldering.Ukuchayeka okungekuhle.Ukuchayeka kabi kuzoholela ekuhlulekeni ukukhweza izingxenye kunqubo elandelayo, ukusoda okungekuhle, futhi, ezimeni ezibucayi, isekethe evulekile. 5. Kungani sidinga ukucubungula ipuleti lokugaya i-wiring ne-solder mask? Re: 1. Indawo yebhodi lesifunda ihlanganisa i-foil-clad board substrate kanye ne-substrate enethusi elifakwe ngaphambili ngemuva kwe-metallization yembobo.Ukuze kuqinisekiswe ukunamathela okuqinile phakathi kwefilimu eyomile nendawo engaphansi, i-substrate surface iyadingeka ukuthi ingabi nezingqimba ze-oxide, amabala kawoyela, izigxivizo zeminwe nokunye ukungcola, kungabikho ama-burrs okubhoboza, futhi kungabikho ukufakwa okuqinile.Ukuze ukwandise indawo yokuxhumana phakathi kwefilimu eyomile kanye nengaphezulu le-substrate, i-substrate nayo iyadingeka ukuba ibe ne-micro-rough surface.Ukuze uhlangabezane nezidingo ezimbili ezingenhla, i-substrate kufanele icutshungulwe ngokucophelela ngaphambi kokuqoshwa.Izindlela zokwelashwa zingafingqwa njengokuhlanzwa kwemishini nokuhlanza amakhemikhali.
2. Isimiso esifanayo siyiqiniso kumaski afanayo we-solder.Ukugaya ibhodi ngaphambi kwemaski ye-solder ukususa izendlalelo ezithile ze-oxide, amabala kawoyela, izigxivizo zeminwe nokunye ukungcola endaweni yebhodi, ukuze kwandiswe indawo yokuxhumana phakathi kweyinki yemaski ye-solder kanye nebhodi bese ulenza liqine.Ingaphezulu lebhodi liyadingeka ukuze libe ne-micro-rough surface (njengesondo lokulungiswa kwemoto, isondo kufanele libe phansi endaweni elukhuni ukuze lihlangane kangcono neglue).Uma ungasebenzisi ukugaya ngaphambi kwe-circuit noma imaskhi ye-solder, ingaphezulu lebhodi elizonamathiselwa noma eliphrintiwe linezendlalelo ze-oxide, amabala kawoyela, njll., izohlukanisa ngokuqondile imaski ye-solder kanye nefilimu yesifunda kusuka kwifomu lebhodi lebhodi. ukuzihlukanisa, futhi ifilimu kule ndawo izowa futhi iqhume enqubweni yakamuva. 6. Iyini i-viscosity?Imuphi umphumela i-viscosity ye-ink ye-solder mask inawo ekukhiqizeni kwe-PCB? Re: I-Viscosity isilinganiso sokuvimbela noma ukumelana nokugeleza.I-viscosity yeyinki yemaski ye-solder inomthelela omkhulu ekukhiqizeni PCB .Lapho i-viscosity iphezulu kakhulu, kulula ukubangela ukungabikho kwamafutha noma ukunamathela kunetha.Lapho i-viscosity iphansi kakhulu, i-fluidity ye-inki ebhodini izokhula, futhi kulula ukubangela ukuba amafutha angene emgodini.Nencwadi yendawo yamafutha angaphansi.Uma kuqhathaniswa, uma ungqimba lwethusi lwangaphandle lujiyile (≥1.5Z0), i-viscosity kayinki kufanele ilawulwe ukuze ibe phansi.Uma i-viscosity iphezulu kakhulu, i-fluidity ye-inki izokwehla.Ngalesi sikhathi, phansi kanye namakhona wesekethe kukhona Ngeke kube namafutha noma kuvezwe. 7. Kuyini ukufana kanye nomehluko phakathi kwentuthuko engeyinhle nokungachazi kahle? Re: Amaphuzu afanayo: a.Kukhona amafutha e-solder mask endaweni lapho ithusi/igolide lidinga ukudayiswa ngemva kwe-mask ye-solder.Imbangela ye-b iyafana.Isikhathi, izinga lokushisa, isikhathi sokuchayeka namandla eshidi lokubhaka ngokuyisisekelo kuyafana. Umehluko: Indawo eyakhiwe ukuchayeka okubi inkulu, futhi imaski ye-solder esele isuka ngaphandle iye ngaphakathi, futhi ububanzi ne-Baidu akufani ngokuqhathaniswa.Iningi lazo livela kumaphedi angewona ama-porous.Isizathu esiyinhloko ukuthi uyinki kule ngxenye uvezwa ukukhanya ultraviolet.Ukukhanya kuyakhanya.Amafutha e-mask asele e-solder kusukela ekuthuthukisweni okungalungile ayancipha kuphela phansi kwesendlalelo.Indawo yayo ayinkulu, kodwa yakha isimo sefilimu encane.Le ngxenye kayinki ibangelwa ikakhulukazi izici ezihlukahlukene zokuphulukisa futhi yakhiwe ngoyinki ongaphezulu.Umumo we-hierarchical, ovame ukuvela kuphedi elinezimbobo.
8. Kungani imaski ye-solder ikhiqiza amabhamuza?Indlela yokuvimbela? Re: (1) Amafutha e-solder mask ngokuvamile axutshwa futhi akhiwe yi-ejenti eyinhloko ye-inki + elaphayo + i-diluent.Ngesikhathi sokuxutshwa nokunyakaziswa kukayinki, umoya othile uzohlala oketshezini.Uma u-inki edlula ku-scraper, ucingo Ngemva kokuba amanetha empintshene futhi agelezele ebhodini, lapho ehlangana nokukhanya okunamandla noma izinga lokushisa elilinganayo ngesikhathi esifushane, igesi eyinki izogeleza ngokushesha ngokusheshisa okuhambisanayo. uyinki, futhi uzoguquguquka kakhulu.
(2), ukuhlukaniswa kwemigqa kuncane kakhulu, imigqa iphakeme kakhulu, uyinki yemaski ye-solder ayikwazi ukuphrinta ku-substrate ngesikhathi sokuphrinta isikrini, okuholela ekubeni khona komoya noma umswakama phakathi kwe-ink ye-solder mask kanye ne-substrate, futhi igesi iyashiswa ukuze yande futhi ibangele amabhamuza ngesikhathi sokwelapha nokuchayeka.
(3) Umugqa owodwa ubangelwa ikakhulukazi umugqa ophezulu.Lapho i-squeegee ixhumana nomugqa, i-angle ye-squeegee kanye nomugqa iyanda, ukuze inki ye-mask ye-solder ayikwazi ukuphrinta phansi komugqa, futhi kukhona igesi phakathi kohlangothi lomugqa kanye ne-mask solder. uyinki , Uhlobo lwamabhamuza amancane luzokwakhiwa lapho kushisa.
Ukuvimbela:
a.Uyinki owenziwe umile isikhathi esithile ngaphambi kokuphrinta,
b.Ibhodi ephrintiwe futhi static isikhathi esithile ukuze igesi uyinki ebusweni ibhodi kancane kancane volatilize ne ukugeleza uyinki, bese uyisusa isikhathi esithile.Bhaka ezingeni lokushisa.
I-Red Solder Mask HDI Printed Circuit Board Manufacturing
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