9. Kuyini isinqumo? Impendulo: Phakathi nebanga elingu-1mm, ukulungiswa kwemigqa noma imigqa yesikhala engakhiwa ukuphikiswa kwefilimu eyomile nakho kungavezwa ngosayizi ophelele wemigqa noma izikhala.Umehluko phakathi kwefilimu eyomile nokuqina kwefilimu yokumelana Ukuqina kwefilimu ye-polyester kuhlobene.Ukuqina kwesendlalelo sefilimu yokumelana, kuyancipha ukulungiswa.Lapho ukukhanya kudlula ipuleti yezithombe kanye nefilimu ye-polyester kanye nefilimu eyomile ivezwa, ngenxa yokusabalalisa ukukhanya ngefilimu ye-polyester, uhlangothi olulula Ngokujulile, i-resolution ephansi. 
10. Kuyini ukumelana ne-etching kanye nokumelana ne-electroplating kwefilimu eyomile ye-PCB? Impendulo: Ukumelana ne-Etching: Ingqimba eyomile yokumelana nefilimu ngemuva kwe-photopolymerization kufanele ikwazi ukumelana nokushona kwesisombululo se-iron trichloride etching, isixazululo se-persulfuric acid etching, i-acid chlorine, isixazululo se-copper etching, i-sulfuric acid-hydrogen peroxide etching solution.Kusixazululo esingenhla se-etching, lapho izinga lokushisa liyi-50-55 ° C, ubuso befilimu eyomile kufanele bungabi nezinwele, ukuvuza, ukugoqa nokuchithwa.Ukumelana ne-Electroplating: ku-acidic yethusi ecwebezelayo ecwebezelayo, i-fluoroborate ejwayelekile yokuhola ingxubevange, i-fluoroborate ekhanyayo ye-tin-lead alloy plating kanye nezixazululo ezahlukahlukene zangaphambi kokucwenga ze-electroplating engenhla, ungqimba lwefilimu elomile lokumelana ngemuva kwe-polymerization akufanele lube nezinwele ezingaphezulu, Ukungena, ukugoqa nokuchithwa . 11. Kungani umshini wokuchayeka udinga ukumunca ivacuum lapho uveza? Impendulo: Emisebenzini yokuchayeka ekukhanyeni okungagqunyiwe (imishini yokuchayeka "enamaphuzu" njengomthombo wokukhanya), izinga lokumuncwa kwevacuum liyisici esikhulu esithinta ikhwalithi yokuchayeka.Umoya ubuye ungqimba oluphakathi nendawo., Kukhona umoya phakathi kwefilimu yokukhipha umoya, khona-ke izokhiqiza ukukhanya okukhanyayo, okuzothinta umphumela wokuchayeka.I-vacuum ayikona nje kuphela ukuvimbela i-refraction yokukhanya, kodwa futhi ukuvimbela igebe phakathi kwefilimu nebhodi ekukhuleni, kanye nokuqinisekisa ukuqondanisa /Ikhwalithi yokuchayeka.
12. Yiziphi izinzuzo zokusebenzisa ipuleti lokugaya umlotha wentaba-mlilo lapho kwelashwa kusengaphambili? ukushiyeka? Impendulo: Izinzuzo: a.Inhlanganisela yezinhlayiya ze-pumice powder abrasive kanye namabhulashi enayiloni ahlikihlwa ngendwangu kakotini, engasusa konke ukungcola futhi aveze ithusi elisha nelihlanzekile;b.Ingenza i-sand-grained ngokuphelele, i-rough and uniform D. Ingaphezulu kanye nomgodi ngeke konakaliswe ngenxa yomphumela wokuthambisa we-nylon brush;d.Ukuguquguquka kwebhulashi lenayiloni elithambile kungakha inkinga yendawo yepuleti engalingani ebangelwa ukuguga kwebhulashi;e.Njengoba indawo yepuleti ifana futhi ingenawo ama-grooves, ukuhlakazeka kokukhanya kokuchayeka kuyancipha, ngaleyo ndlela kuthuthukiswe ukulungiswa kwezithombe.Ukungalungi: Okubi ukuthi i-pumice powder kulula ukulimaza izingxenye zemishini yemishini, ukulawulwa kokusabalalisa usayizi wezinhlayiyana zempushana ye-pumice kanye nokususwa kwensalela ye-pumice powder ebusweni be-substrate (ikakhulukazi emigodini. ).
13. Yimuphi umphumela lapho ibhodi lesifunda elithuthukisa khona iphuzu libe likhulu kakhulu noma libe lincane kakhulu? Impendulo: Isikhathi esifanele sokuthuthukiswa sinqunywa iphuzu lokuthuthukiswa (iphuzu lapho ifilimu eyomile engaveziwe isuswa ebhodini eliphrintiwe).Iphuzu lokuthuthukiswa kufanele ligcinwe njengephesenti elingaguquki lobude obuphelele besigaba sokuthuthukiswa.Uma iphuzu elikhulayo liseduze kakhulu nokuphuma kwesigaba esikhulayo, ifilimu yokumelana ne-unpolymerized ngeke ihlanzwe ngokwanele futhi ithuthukiswe, futhi izinsalela zokumelana zingahlala phezu kwebhodi futhi kubangele ukuthuthukiswa okungcolile.Uma indawo ethuthukayo iseduze kakhulu nomnyango wesigaba esathuthukayo, ifilimu eyomile eyenziwe nge-polymerized ingase iqoshwe yi-Na2C03 futhi ibe noboya ngenxa yokuxhumana isikhathi eside nesixazululo esikhulayo.Imvamisa indawo ethuthukayo ilawulwa ngaphakathi kuka-40% -60% wengqikithi yobude besigaba esathuthukayo (35% -55% yenkampani yethu). 14. Kungani sidinga ukubhaka kusengaphambili ibhodi ngaphambi kokuba izinhlamvu ziphrintwe? Impendulo: Ibhodi eliphekwe ngaphambilini a liwukuthuthukisa amandla okubopha phakathi kwebhodi nezinhlamvu ngaphambi kokuba izinhlamvu ziphrintwe, kanye no-b ukuthuthukisa ubulukhuni beyinki yemaski ye-solder ebusweni bebhodi ukuvimbela isiphambano samafutha we-solder mask. -ukusabalala okubangelwa ukuphrinta kwezinhlamvu noma ukucubungula okulandelayo. 15. Kungani sidinga ukushwiba ibhulashi lomshini wokugaya amapuleti wangaphambi kokwelashwa? Impendulo: Kukhona ibanga elithile phakathi kwamaphinikhodi ebhulashi.Uma ungasebenzisi i-sway ukugaya ipuleti, kuzoba nezindawo eziningi ezingeke zigqokwe, okuholela ekuhlanzeni okungalingani kwendawo yepuleti.Ngaphandle kokuzamazama, kuzokwakhiwa umsele oqondile endaweni yepuleti.Ibangela ukuphuka kocingo, futhi kulula ukugqabula izimbobo futhi kukhiqizwe isenzakalo esisila ngaphandle kokushwiba unqenqema lwembobo. 16. I-squeegee idlala muphi umphumela ekunyatheliseni? Impendulo: I-angle ye-squeegee ilawula ngokuqondile inani lamafutha, futhi ukufana kwe-blade ebusweni kuthinta ngokuqondile ikhwalithi yendawo yokunyathelisa. 17. Iyini imiphumela ye-solder mask kanye nezinga lokushisa kanye nomswakama ekamelweni elimnyama ekukhiqizeni kwe-PCB? Impendulo: Lapho izinga lokushisa nomswakama ekamelweni elimnyama liphakeme kakhulu noma liphansi kakhulu: 1. Kuzokwandisa udoti emoyeni, 2. Isenzakalo sokunamathela kwefilimu kulula ukuvela ekuhleleni, 3. Kulula ukubangela i ifilimu ukukhubaza, 4. Kulula ukubangela indawo yebhodi ukuba i-oxidize. 18. Kungani i-solder mask ingasetshenziswa njengendawo yokukhula? Impendulo "Ngenxa yokuthi kunezici eziningi eziguquguqukayo kuma-inks we-solder mask. Okokuqala, izinhlobo zama-inki ziyinkimbinkimbi kakhulu. Izakhiwo ze-inki ngayinye zihlukile. Ngesikhathi sokuphrinta, ubukhulu boyinki webhodi ngalinye buzobangela ukufana ngenxa Ithonya lokucindezela, isivinini kanye ne-viscosity. Azifani nefilimu eyomile. Ubukhulu befilimu eyodwa bufana kakhulu. Ngesikhathi esifanayo, inki ye-solder yokumelana nayo ithintwa isikhathi sokubhaka esihlukene, izinga lokushisa, namandla okuchayeka. phakathi nenqubo yokukhiqiza.Umphumela webhodi uyafana.Ngakho-ke ukubaluleka kokusebenza kwe-solder mask njengendawo yokuthuthukiswa akukukhulu.
I-Aluminium Base Circuit Board Ngokwezifiso
English en 
