Ngophuhliso oluqhubekayo lwenzululwazi ye-elektroniki kunye nobuchwepheshe, iteknoloji ye-PCB nayo yenzeke utshintsho olukhulu, kwaye inkqubo yokuvelisa nayo ifuna ukuqhubela phambili.Kwangaxeshanye ishishini ngalinye kwiimfuno inkqubo ibhodi PCB ziye zaphucuka ngokuthe ngcembe, ezifana cell phones kunye neekhompyutha kwibhodi yesekethe, ukusetyenziswa kwegolide, kodwa nokusetyenziswa kobhedu, nto leyo ephumela kwiingenelo kunye nokungalungi kwebhodi ngokuthe ngcembe. kuba lula ukwahlula.

Sikuthatha ukuba uqonde inkqubo yomphezulu webhodi yePCB, thelekisa iingenelo kunye nokungalunganga kokugqiba komphezulu webhodi yePCB kunye neemeko ezifanelekileyo.

Ngokucacileyo ukusuka ngaphandle, umaleko wangaphandle webhodi yesekethe unemibala emithathu ephambili: igolide, isilivere, ibomvu ekhanyayo.Ngokokwahlulwa kwexabiso: igolide yeyona ibiza kakhulu, isilivere ilandelayo, ibomvu ekhanyayo yeyona inexabiso eliphantsi, ukusuka kumbala okunene kulula kakhulu ukufumanisa ukuba ngaba abavelisi behardware banqumle iikona.Nangona kunjalo, ibhodi yesekethe yesekethe yangaphakathi ilubhedu olusulungekileyo, oko kukuthi, ibhodi yobhedu engenanto.

A, Ibhodi yobhedu engenanto
Izinto eziluncedo: ixabiso eliphantsi, indawo ethe tyaba, i-solderability elungileyo (kwimeko yokungabi ne-oxidized).

Ukungalungi: kulula ukuchatshazelwa yi-asidi kunye nomswakama, ayikwazi ukugcinwa ixesha elide, kwaye kufuneka isetyenziswe ngaphakathi kweeyure ze-2 emva kokukhupha, kuba ubhedu lufumaneka ngokulula xa lubonakaliswe emoyeni;ayinakusetyenziselwa amacala amabini, kuba icala lesibini liye lafakwa i-oxidized emva kokuhamba kwakhona kokuqala.Ukuba kukho indawo yokuvavanya, kufuneka udibanise i-solder paste eprintiweyo ukuthintela i-oxidation, ngaphandle koko okulandelayo akuyi kukwazi ukuqhagamshelana ne-probe kakuhle.

Ubhedu olusulungekileyo lunokuthi lube ne-oxidized ngokulula ukuba luvezwe emoyeni, kwaye umaleko wangaphandle kufuneka ube nomgangatho wokukhusela ongentla.Kwaye abanye abantu bacinga ukuba igolide tyheli lubhedu, ayisiyiyo ingcamango echanekileyo leyo, kuba lolo lubhedu olungaphezulu komgangatho okhuselayo.Ngoko ke kufuneka ibe yindawo enkulu yokufakwa kwegolide ebhodini, oko kukuthi, ndikuzise ngaphambili ukuba uqonde inkqubo yegolide ye-sink.

B, Ibhodi egqitywe ngegolide

Ukusetyenziswa kwegolide njengoluhlu lwe-plating, enye kukuququzelela i-welding, okwesibini kukuthintela ukubola.Kwanasemva kweminyaka eliqela yeenkumbulo zezinti zeminwe yegolide, isakhanya njengangaphambili, ukuba ukusetyenziswa kwantlandlolo kobhedu, i-aluminiyam, intsimbi, ngoku kuye kwagqwala kwaba yimfumba yenkunkuma.

I-Gold plating layer isetyenziswa kakhulu kwiipads zecandelo lebhodi yesekethe, iminwe yegolide, i-shrapnel yokudibanisa kunye nezinye iindawo.Ukuba ufumanisa ukuba ibhodi yesekethe ngenene isilivere, ihamba ngaphandle kokuthetha, ukufowunela umnxeba wamalungelo abathengi ngqo, kufuneka umenzi ukusika iikona, akazange asebenzise izinto ngokufanelekileyo, usebenzisa ezinye iintsimbi ukuqhatha abathengi.Sisebenzisa ibhodi yesekethe yeselfowuni esetyenziswa kakhulu ubukhulu becala ibhodi etyalwe ngegolide, ibhodi yegolide etshoneyo, iibhodi zekhompyuter, iibhodi ezivakalayo kunye neebhodi zesekethe zedijithali aziyiyo ibhodi yegolide.

Iingenelo kunye nokungalunganga kwenkqubo yegolide etshoniweyo eneneni akunzima ukuyizoba.

Izinto eziluncedo: akukho lula kwi-oxidation, inokugcinwa ixesha elide, umphezulu usicaba, ulungele ukuwelda izikhonkwane ze-gap ezintle kunye namacandelo anamalungu amancinci e-solder.Ikhethwa kwiibhodi zePCB ezinezitshixo (ezifana neebhodi zeselfowuni).Inokuphinda iphindwe ngamaxesha amaninzi phezu kwe-soldering ephinda iphinde iphinde ibuyele ayinakwenzeka ukunciphisa ukuthengiswa kwayo.Ingasetyenziselwa njenge-substrate ye-COB (Chip On Board) yokumakisha.

Ukungalungi: Iindleko eziphezulu, amandla aphantsi e-solder, kulula ukuba nengxaki yeplate emnyama ngenxa yokusetyenziswa kwenkqubo ye-nickel engena-electro.I-nickel layer iya ku-oxidize ngokuhamba kwexesha, kwaye ukuthembeka kwexesha elide kuyingxaki.

Ngoku siyazi ukuba igolide yigolide, isilivere yisilivere?Kakade akunjalo, yitoti.

C, HAL/ HAL LF
Ibhodi enemibala yeSilver ibizwa ngokuba yibhodi yetoti yokutshiza.Ukutshiza umaleko wetoti kumaleko angaphandle wemigca yobhedu nako kunokunceda ukunyibilikisa.Kodwa ayikwazi ukubonelela ngokuthembeka koqhagamshelwano oluhlala ixesha elide njengegolide.Kwizinto ezithe zathengiswa zinefuthe elincinci, kodwa ngenxa yokuvezwa kwexesha elide kwiipads zomoya, ukuthembeka akwanelanga, njengeepads zokumisa, i-bullet pin sockets, njl. uqhagamshelwano olubi.Ngokusisiseko isetyenziswe njengebhodi yesekethe yemveliso yedijithali encinci, ngaphandle kokukhetha, yibhodi yetoti yokutshiza, isizathu sincinci.

Izinto eziluncedo nezingeloncedo zishwankathelwa ngolu hlobo lulandelayo

Izinto eziluncedo: ixabiso eliphantsi, ukusebenza kakuhle kwe-soldering.

Ukungalungi: ayifanelekanga ukudibanisa izikhonkwane ze-gap kunye namalungu amancinci kakhulu, ngenxa yokuba umphezulu othe tyaba webhodi yetoti yokutshiza ulambatha.Kwi-PCB processing kulula ukuvelisa amaso etoti (solder bead), izikhonkwane pitch ecolekileyo (pitch fine) amacandelo lula ukwenza isekethe emfutshane.Xa isetyenziselwa inkqubo ye-SMT enamacala amabini, ngenxa yokuba icala lesibini liye laba yi-reflow ephezulu yobushushu, kulula ukunyibilikisa i-tin yokutshiza kwakhona kwaye uvelise amaso e-tin okanye amaconsi amanzi afanayo ngokuxhuzula abe ngamathontsi amabala e-tin angqukuva, okukhokelela ekubeni umphezulu ongalinganiyo ngakumbi kwaye ngaloo ndlela kuchaphazela ingxaki ye-soldering.

Ngaphambili kukhankanyiwe ibhodi yesekethe ukukhanya cheapest ebomvu, oko kukuthi, isibane thermoelectric ukwahlula ubhedu substrate ubhedu mgodini.

4, ibhodi yenkqubo ye-OSP

Ifilimu ye-Organic flux.Kuba indalo, hayi intsimbi, ngoko ke inexabiso eliphantsi kunenkqubo yetoti yokutshiza.

Iingenelo kunye nokungalunganga kwayo

I-Advantages: inazo zonke iingenelo zebhodi yobhedu ye-solder engenanto, iibhodi eziphelelwe lixesha nazo zinokuphinda zenziwe kwakhona xa unyango lomphezulu.

Ukungalungi: Ichatshazelwa lula yiasidi kunye nokufuma.Xa isetyenziswe kwi-reflow yesibini, kufuneka yenziwe ngaphakathi kwexesha elithile, kwaye ngokuqhelekileyo i-reflow yesibini iya kusebenza ngaphantsi.Ukuba ixesha lokugcinwa lidlula kwiinyanga ezintathu, kufuneka lihlaziywe.I-OSP ngumaleko okhuselayo, ngoko ke indawo yokuvavanya kufuneka igxininiswe nge-solder paste ukususa umaleko we-OSP wokuqala ukuze uqhagamshelane nendawo yenaliti yovavanyo lombane.

Injongo yodwa yale filimu yezinto eziphilayo kukuqinisekisa ukuba i-foil yobhedu yangaphakathi ayinayo i-oxidized phambi kokuba i-soldering.Nje ukuba ifudunyezwe ngexesha le-soldering, le filimu iyaphuphuma.I-Solder iyakwazi ukuthengisa ucingo lobhedu kunye namalungu kunye.

Kodwa iyamelana kakhulu ne-corrosion, ibhodi ye-OSP, evezwe emoyeni kangangeentsuku ezilishumi okanye ngaphezulu, awukwazi ukuthengisa izinto.

Iibhodi zekhompyuter zinenkqubo eninzi ye-OSP.Ngenxa yokuba indawo yebhodi inkulu kakhulu ukusebenzisa i-plating yegolide.