Xa uyila iipads zePCB kwi Uyilo lwebhodi yePCB , kuyimfuneko ukuyila ngokungqongqo ngokuhambelana neemfuno kunye nemigangatho efanelekileyo.Kuba kwi-SMT patch processing, uyilo lwe-PCB pad lubaluleke kakhulu.Uyilo lwepadi luya kuchaphazela ngokuthe ngqo ukuthengiswa, ukuzinza kunye nokuhanjiswa kobushushu kwamacandelo.Inxulumene nomgangatho wokulungiswa kwepatch.Ke ngoko yintoni umgangatho woyilo we-PCB? 1. Imigangatho yokuyila imilo kunye nobukhulu beepads zePCB: 1. Fowunela ithala leencwadi elisemgangathweni lePCB. 2. Ubuncinci becala elinye le-pad alikho ngaphantsi kwe-0.25mm, kwaye ububanzi obukhulu be-pad yonke abukho ngaphezu kwe-3 amaxesha okuvula icandelo. 3. Zama ukuqinisekisa ukuba umgama phakathi kwemida yeepads ezimbini mkhulu kuno-0.4mm. 4. Iipads ezinemingxuma engaphezulu kwe-1.2mm okanye i-pad diameters ezingaphezu kwe-3.0mm kufuneka ziyilwe njengeepads ezimile njengedayimani okanye okwequincunx. 5. Kwimeko yocingo oluxineneyo, kucetyiswa ukuba usebenzise iiplati zokudibanisa i-oval kunye ne-oblong.Ububanzi okanye ububanzi obuncinci bepaneli enye yephaneli yi-1.6mm;i-pad yesiphaluka ebuthathaka-yangoku yebhodi ephindwe kabini idinga kuphela ukongeza i-0.5mm kwi-diameter yomngxuma.Iphedi enkulu kakhulu inokubangela ukuba kube lula ukuwelda ngokuqhubekayo ngokungeyomfuneko.
PCB iphedi ngobungakanani obuqhelekileyo:
Umngxuma ongaphakathi wepadi ngokuqhelekileyo awukho ngaphantsi kwe-0.6mm, kuba umngxuma omncinci kuno-0.6mm akulula ukuwucubungula xa ubetha ukufa.Ngokuqhelekileyo, i-diameter ye-pin yentsimbi kunye ne-0.2mm isetyenziswa njengobubanzi bomngxuma ongaphakathi wepadi, njengobubanzi bepini yentsimbi ye-resistor Xa i-0.5mm, ububanzi bomngxuma ongaphakathi wepadi buhambelana no-0.7mm. , kwaye i-pad diameter ixhomekeke kububanzi bomngxuma ongaphakathi.
Ezintathu, iindawo zoyilo lokuthembeka kweepadi zePCB:
1. I-Symmetry, ukwenzela ukuba kuqinisekiswe ibhalansi yoxinzelelo lomphezulu we-solder etyhidiweyo, iipads kuzo zombini iziphelo kufuneka zibe symmetrical.
2. Isithuba sepadi.Isithuba esikhulu kakhulu okanye esincinci sepadi siya kubangela iziphene ekuthengiseni.Ke ngoko, qinisekisa ukuba isithuba phakathi kweziphelo zecandelo okanye izikhonkwane kunye neepads zifanelekile.
3. Ubungakanani obusele bepadi, ubungakanani obuseleyo becandelo ekupheleni okanye ipini kunye nephedi emva kokudibanisa kufuneka kuqinisekiswe ukuba i-solder joint ingenza i-meniscus.
4. Ububanzi bepadi kufuneka bufanane ngokusisiseko nobubanzi becandelo okanye iphini.
Uyilo oluchanekileyo lwe-pad ye-PCB, ukuba kukho inani elincinci le-skew ngexesha lokulungiswa kwe-patch, inokulungiswa ngenxa yoxinzelelo lomphezulu we-solder etyhidiweyo ngexesha lokuphinda kufakwe i-solder.Ukuba uyilo lwephedi ye-PCB aluchanekanga, nokuba indawo yokubeka ichanekile kakhulu, iziphene ze-solder ezifana ne-component position offset kunye neebhulorho zokunqunyanyiswa ziya kwenzeka ngokulula emva kokuphinda kufakwe i-soldering.Ngoko ke, xa uyila i-PCB, uyilo lwephedi yePCB kufuneka lulumke kakhulu.
1.6mm ubukhulu bamva nje imaski yesoda eluhlaza ibhodi PCB ngomnwe wegolide Ibhodi yesekethe ye-FR4 CCL
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