
Uvavanyo lwe-TDR okwangoku lusetyenziswa ikakhulu kwi-PCB yabavelisi bebhodi yesekethe yebhetri (iibhodi zesekethe eziprintiweyo) imigca yomqondiso kunye novavanyo lwe-impedance yesixhobo.Kukho izizathu ezininzi ezichaphazela ukuchaneka kovavanyo lwe-TDR, ngokukodwa ukubonakalisa, ukulinganisa, ukukhetha ukufunda, njl.
I-1, 铜箔基材CCL (i-FPC Copper Clad Laminate) yenziwe ngamacandelo amathathu efoyile yobhedu + iglu + substrate.Ukongeza, kukwakho ne-non-adhesive substrates, oko kukuthi, indibaniselwano yemigangatho emibini yefoyile yobhedu + i-substrate, ebiza kakhulu kwaye ifanelekile kwiimveliso ezifuna amaxesha angaphezu kwe-10W yokuphila ukugoba.1.1 Ifoyile yobhedu Ngokwemathiriyeli, yahlulwe yaba yicopp eqengqelekayo...
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