Zvatinowanzo kutaura nezvazvo ndezvekuti " FR-4 Fiber Kirasi Material PCB Board " izita rekodhi yegiredhi yezvigadzirwa zvisingadziviri moto. Inomiririra kutsanangurwa kwezvinhu izvo resin zvinhu zvinofanirwa kudzima pachazvo mushure mekupiswa. Harisi zita renyama, asi rudzi rwezvinhu. Material giredhi, saka kune akawanda marudzi eFR-4 giredhi zvinhu zvinoshandiswa mu general circuit board parizvino, asi mazhinji acho akagadzirwa neanonzi Tera-Function epoxy resin plus filler (Filler) uye glass fiber Iyo inoumbwa zvinhu yakagadzirwa.
Flexible yakadhindwa redunhu bhodhi (Flexible Printed Circuit Board, yakapfupikiswa FPC) inonzi zvakare inochinjika yakadhindwa redunhu bhodhi, kana inochinjika yakadhindwa redunhu bhodhi.Iyo inochinjika yakadhindwa yedunhu bhodhi chigadzirwa chakagadzirwa uye chinogadzirwa pane inoshanduka substrate nenzira yekudhinda. 
Kune marudzi maviri makuru eakadhindwa edunhu bhodhi substrates: organic substrate zvinhu uye inorganic substrate zvinhu, uye organic substrate zvinhu ndizvo zvakanyanya kushandiswa.Iwo maPCB substrates anoshandiswa akasiyana kune akasiyana maseru.Semuyenzaniso, 3 kusvika 4 layer boards dzinoda kushandisa zvakafanogadzirwa zvakaumbwa, uye maviri-side board anonyanya kushandisa girazi-epoxy zvinhu. Pakusarudza pepa, isu tinofanirwa kufunga nezve maitiro eSMT Mune inotungamira-isina-isina dhizaini yemagetsi maitiro, nekuda kwekuwedzera kwekushisa, dhigirii yekukotama yebhodhi redunhu rakadhindwa kana kupisa kunowedzera.Naizvozvo, zvinodikanwa kushandisa bhodhi rine diki dhigirii rekukotama muSMT, senge FR-4 mhando substrate.
Sezvo kuwedzera uye kuputika kushushikana kwe substrate mushure mekupisa kunokanganisa zvikamu, zvinozoita kuti electrode ibvise uye kuderedza kuvimbika.Nokudaro, iyo coefficient yekuwedzera kwezvinhu inofanira kubhadharwa pakusarudza zvinhu, kunyanya kana chikamu chacho chakakura kudarika 3.2 × 1.6mm.PCB inoshandiswa mukusangana kwepamusoro tekinoroji inoda yakakwirira yekupisa conductivity, yakanakisa kupisa kupisa (150 ℃, 60min) uye solderability (260 ℃, 10s), yakakwirira mhangura foil adhesion simba (1.5 × 104Pa kana kupfuura) uye kukotama simba (25 × 104Pa), high conductivity uye dielectric diki nguva dzose, punchability yakanaka (yakarurama ± 0.02mm) uye kuenderana nekuchenesa vamiririri, mukuwedzera, chitarisiko chinodiwa kuti chive chakatsetseka uye chakapfava, pasina kuputika, kuputika, mavanga uye mavara emarara, nezvimwewo. 
PCB ukobvu kusarudzwa Ukobvu hwebhodhi rakadhindwa redunhu ndeye 0.5mm, 0.7mm, 0.8mm, 1mm, 1.5mm, 1.6mm, (1.8mm), 2.7mm, (3.0mm), 3.2mm, 4.0mm, 6.4mm, iyo 0.7mm mm uye 1.5 Iyo PCB ine hukobvu hwemm inoshandiswa kugadzira mapuranga ane mativi maviri ane zvigunwe zvegoridhe, uye 1.8mm uye 3.0mm hukuru husina mwero. Kubva pamaonero ekugadzirwa, saizi yebhodhi redunhu rakadhindwa haifanire kunge iri pasi pe250 × 200mm, uye saizi yakakodzera kazhinji (250 ~ 350mm) × (200 × 250mm).Kune maPCB ane mativi akareba asingasviki 125mm kana mativi akafara asingasviki 100mm, nyore Kushandisa nzira yejigsaw. Tekinoroji yekumisikidza yepamusoro inotaridza huwandu hwekukotama hwe substrate nehupamhi hwe1.6mm seyepamusoro warpage ≤0.5mm uye yakaderera warpage ≤1.2mm 
English en 
