Chero ani anobatanidzwa mukati medhinda redunhu bhodhi ( PCB ) indasitiri inonzwisisa kuti maPCB ane mhangura anopedzisa pamusoro pavo.Kana ivo vakasara vasina kudzivirirwa ipapo mhangura ichaita oxidize uye yakaipa, zvichiita kuti bhodhi redunhu rirege kushandiswa.Iyo yekumusoro kupedzisa inoumba yakakosha interface pakati pechikamu nePCB.Iyo yekupedzisa ine mabasa maviri akakosha, kuchengetedza yakafumurwa yemhangura yedunhu uye nekupa inotengeswa pamusoro paunenge uchiunganidza (soldering) zvikamu kune yakadhindwa redunhu bhodhi.

HASL / Tungamira Yemahara HASL

HASL ndiyo inonyanya kupedzwa kwepamusoro inoshandiswa muindasitiri.Iyo nzira inosanganisira kunyudza masekiti board mupoto yakanyungudutswa yerata/lead alloy uyezve kubvisa yakawandisa solder uchishandisa 'mapanga emhepo', ayo anofuridza mweya unopisa pamusoro pebhodhi.

Imwe yemabhenefiti asingatarisirwe eiyo HASL maitiro ndeyekuti ichafumura iyo PCB kune tembiricha inosvika 265 ° C iyo inozoratidza chero zvingangoitika nyaya dze delamination zvakanaka zvisati zvabatanidzwa zvinodhura kubhodhi.

HASL Yapedza Kaviri Madivi Akadhindwa Circuit Board

Zvakanakira:

• Mutengo Wakaderera
• Zvakawanda Inowanikwa
• Re-workable
• Yakanakisa Sherufu Hupenyu

Zvakaipa:

• Zvisina Kuenzana Surfaces
• Haina Yakanakira Pitch Yakanaka
• Ine lead (HASL)
• Thermal Shock
• Solder Bridging
• Yakavharwa kana Yakaderedzwa PTH's (Yakanyudzwa Nemakomba)

Kunyudza Tin

Sekureva kweIPC, iyo Association Connecting Electronics Indasitiri, Immersion Tin (ISn) isimbi inopedzwa inoiswa nekemikari displacement reaction iyo inoiswa zvakananga pamusoro pesimbi yedare redunhu, ndiko kuti, mhangura.Iyo ISn inodzivirira iri pasi pemhangura kubva kune oxidation pamusoro pehupenyu hwayo hwekuda pasherufu.

Mhangura netin zvisinei zvine hukama hwakasimba kune mumwe nemumwe.Kupararira kwesimbi mune imwe kuchaitika zvisingadzivisiki, zvichikanganisa hupenyu hwesherufu yedhipoziti uye kuita kwekupedzisa.Migumisiro yakaipa yekukura kwendebvu inotsanangurwa zvakanaka mumabhuku ane chekuita neindasitiri uye misoro yemapepa akati wandei akadhindwa.

Zvakanakira:

• Flat Surface
• Kwete Pb
• Re-workable
• Sarudzo Yepamusoro Yekudzvanya Fit Pin Insertion

Zvakaipa:

• Zviri Nyore Kukonzera Kubata Kukuvadza
• Nzira Inoshandisa Carcinogen (Thiourea)
• Yakafumurwa Tin paFinal Assembly inogona Corrode
• Tin Whiskers
• Haina Yakanaka kune Akawanda Reflow / Assembly Maitiro
• Zvakaoma Kuyera Ukobvu

Kunyudza Sirivha

Sirivha yekunyudza ndeye-isina-electrolytic kemikari kupera inoiswa nekunyudza iyo PCB yemhangura mutangi resirivheri ayoni.Iyo yakanaka sarudzo yekupedzisa yemabhodhi edunhu ane EMI shieldingand inoshandiswawo kune dome macontact uye waya bonding.Avhareji yepasi ukobvu hwesirivheri ndeye 5-18 microinches.

Nezvinonetsa zvezvakatipoteredza zvakaita seRoHS neWEE, sirivheri yekunyudza iri nani pane zvakatipoteredza kupfuura HASL neENIG.Iyo inozivikanwa zvakare nekuda kwemutengo wayo wakaderera pane ENIG.

Zvakanakira:

• Inoshanda zvakaenzana kupfuura HASL
• Zvakatipoteredza zviri nani pane ENIG uye HASL
• Hupenyu hwesherufu hwakaenzana neHASL
• Yakanyanya kudhura-inoshanda kupfuura ENIG

Zvakaipa:

• Inofanira kutengeswa mukati mezuva iro PCB inobviswa kubva pakuchengetwa
• Inogona kusvibiswa nyore nyore nekubata kusina kunaka
• Isina kusimba kupfuura ENIGdue isina dhizaini ye nickel pasi

OSP / Entek

OSP (Organic Solderability Preservative) kana anti-tarnish inochengetedza nzvimbo yemhangura kubva mukuokisisa nekuisa yakatetepa inodzivirira yechinhu pamusoro pemhangura yakaburitswa kazhinji uchishandisa nzira inofambiswa.

Inoshandisa mvura-based organic compound iyo inosarudza zvisungo kumhangura uye inopa organometallic layer inodzivirira mhangura isati yatengeswa.Iyo zvakare yakasvibira zvakanyanya kwezvakatipoteredza kana ichienzaniswa nemamwe akajairika lead-isina kupera, ayo anotambura nekuve ane muchetura kana kuwedzera zvakanyanya simba rekushandisa.

Zvakanakira:

• Flat Surface
• Kwete Pb
• Simple Process
• Re-workable
• Mari Inoshanda

Zvakaipa:

• Hapana Nzira Yekuyera Hukobvu
• Haina Yakanakira PTH (Yakapfatwa Nemakomba)
• Pfupi Sherufu Hupenyu
• Inogona Kukonzera ICT Matambudziko
• Yakafumurwa Cu paGungano Rekupedzisira
• Kubata Sensitive

Electroless Nickel Immersion Gold (ENIG)

ENIG isimbi miviri yakaturikidzana ye2-8 μin Au pamusoro pe120-240 μin Ni.Nickel ndiyo inodzivirira kumhangura uye ndiyo nzvimbo inotengeswa zvinhu zvacho.Iyo goridhe inodzivirira nickel panguva yekuchengetedza uye zvakare inopa yakaderera yekubata kuramba inodiwa kune yakatetepa goridhe deposits.ENIG parizvino ndiyo inonyanya kushandiswa kupedzisa muPCB indasitiri nekuda kwekukura uye kuita kweiyo RoHs regulation.

Yakadhindwa Circuit Board ine Chem Gold Surface Finish

Zvakanakira:

• Flat Surface
• Kwete Pb
• Yakanakira PTH (Yakapfachuka Nemakomba)
• Upenyu Hwakareba

Zvakaipa:

• Zvinodhura
• Not Re-workable
• Black Pad / Black Nickel
• Kukuvadza kubva kuET
• Kurasika kwechiratidzo (RF)
• Complicated Process

Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

ENEPIG, hama nyowani kudunhu redunhu nyika yekupedzisa, akatanga kuuya pamusika mukupera kwema90s.Iyi matatu-layer metallic coating ye nickel, palladium, uye goridhe inopa sarudzo senge pasina vamwe: inosungika.ENEPIG yekutanga kutsemuka pane yakadhindwa yedunhu bhodhi bhodhi kurapwa yakanyungudika nekugadzira nekuda kwekunyanya kudhura kwayo kwepalladium uye kushomeka kwekushandisa.

Kudiwa kwemutsara wekugadzira wakasiyana kwakanga kusingagamuchiri nekuda kwezvikonzero zvakafanana.Munguva pfupi yapfuura, ENEPIG yakadzoka sekukwanisa kusangana nekuvimbika, kurongedza zvinodiwa, uye RoHS zviyero ndeyekuwedzera nekupedzisa uku.Iyo yakakwana kune yakakwira frequency application uko nzvimbo inogumira.

Kana ichienzaniswa nemamwe mapeji mana epamusoro, ENIG, Lead Free-HASL, sirivheri yekunyudza uye OSP, ENEPIG inokunda zvese padanho rekupedza-assembly corrosion level.

Zvakanakira:

• Yakanyanya Flat Surface
• Hapana Inotungamira Yemukati
• Multi-Cycle Assembly
• Yakanakisa Solder Majoini
• Wire Bondable
• Hapana Corrosion Risks
• 12 Mwedzi kana Hukuru Hupenyu Hwesherufu
• Hapana Nhema Pad Njodzi

Zvakaipa:

• Zvichiri Zvakati Kudhura
• Inoshanda Patsva Nezvimwe Zvisingakwanisi
• Processing Limits

Ndarama – Hard Gold

Hard Electrolytic Goridhe ine dhizaini regoridhe rakaputirwa pamusoro pechivharo jasi re nickel.Goridhe rakaomarara rakasimba zvakanyanya, uye rinonyanya kushandiswa kunzvimbo dzakapfeka-pamusoro senge zvigunwe zvekubatanidza zvigunwe nemakiyipadhi.

Kusiyana neENIG, ukobvu hwayo hunogona kusiyanisa nekudzora nguva yekutenderera kutenderera, kunyangwe iwo akajairwa mashoma makoshero ezvigunwe ari 30 μin goridhe pamusoro pe100 μin nickel yeKirasi 1 uye Kirasi 2, 50 μin goridhe pamusoro pe100 μin nickel yeKirasi 3.

Ndarama yakaoma haiwanzo kushandiswa kunzvimbo dzinotengeswa, nekuda kwekudhura kwayo uye kuderera kwayo.Ukobvu hwepamusoro hunonzi IPC hunogona kutengeswa i17.8 μin, saka kana rudzi urwu rwegoridhe ruchifanirwa kushandiswa panzvimbo inotengeswa, ukobvu hwezita hunokurudzirwa hunofanirwa kunge huri 5-10 μin.

Zvakanakira:

• Yakaoma, Yakasimba Yepamusoro
• Kwete Pb
• Upenyu Hwakareba

Zvakaipa:

• Zvakanyanya Kudhura
• Kuwedzera Kugadziridza / Basa Rakanyanya
• Kushandisa Resist / Tepi
• Plating / Bhazi Bhazi rinodiwa
• Kuganhura
• Kuomerwa neImwe Surface Inopedza
• Etching Undercut inogona Kutungamira kune Slivering / Flaking
• Not Solderable Pamusoro pe17 μin
• Pedzisa Haisi Kunyatso Kuvhara Trace Sidewalls, Kunze kweMunzvimbo dzeminwe

Kutsvaga Yakakosha Surface Pedzisa Yenyu Yedunhu Board?