1，铜箔基材CCL (FPC Copper Clad Laminate)

Inoumbwa nezvikamu zvitatu zvemhangura foil + glue + substrate.Pamusoro pezvo, kune zvakare asiri-adhesive substrates, ndiko kuti, musanganiswa wezvikamu zviviri zvemhangura foil + substrate, iyo inodhura uye yakakodzera
Zvezvigadzirwa zvinoda kupfuura 10W nguva dzehupenyu hwekukotama.

1.1 Copper foil
Panyaya yezvinhu, yakakamurwa kuita mhangura yakakungurutswa (Rolled Anneal Copper Foil) uye electrolytic mhangura (Electrodeposited Copper).
Foil), maererano nehunhu, michina yemhangura yakakungurutswa iri nani, uye yakawanda yemhangura yakakungurutswa inoshandiswa kana kuchinjika kuchidikanwa.ukobvu
Ye1/30Z.1/20Z.10Z.2OZ nemamwe marudzi mana.

1.2 CCL
Panyaya yezvigadzirwa, yakakamurwa kuita PI (Polyamide) Firimu uye PET (Polyester) Firimu.Mutengo wePI wakakwira, asi iwo
Iyo ine zvirinani kuramba murazvo, uye mutengo wePET wakaderera, asi haudziviriri kupisa.Naizvozvo, kana paine kudikanwa kwewelding, vazhinji vavo vanoshandisa PI zvinhu.Kazhinji mukukora
1/2 miriyoni, 1 miriyoni, 2 miriyoni.

1.3 Adhesive
Pane kazhinji marudzi maviri eglue: Acrylic (acrylic glue) uye Epoxy (epoxy glue).Inonyanya kushandiswa ndeye epoxy glue.ukobvu
0.4 ~ 2mil iripo, kazhinji shandisa 18um gobvu guruu.

2, Kavha firimu
Iyo yekuvhara firimu inoumbwa nebase material + glue, uye hwaro hwezvinhu hwakakamurwa kuita PI uye PET.Ukobvu huri kubva 0.5 kusvika 1.4mi.

3, Stiffener ( Reinforcing material)
3.1 Basa: Kuti uite weld zvikamu munzvimbo yemunharaunda yebhodhi rakapfava, wedzera kusimbiswa kwekuisa uye kubhadhara kune ukobvu hwebhodhi rakapfava.
3.2 Zvinyorwa: PI/PET/FR4/SUS
3.3 Musanganiswa nzira:
PSA (Pressure Sensitive Adhesive): kudzvanywa kwemhando yemhando (yakadai se3M yakatevedzana)
Thermal Set: Thermosetting (simba rekubatanidza, kusagadzikana kwekunyungudika, kuramba kupisa, kuramba kukwira)

4, Single Flex PCB, Double Flex PCB, Multi Flex PCB

4.1 Single side

4.2 Rutivi ruviri

4.3 Inoumbwa bhodhi

4.4 Zvivezwa

4.5 Multilayer

4.6 Flex Rigid PCB

Kana paine mubvunzo, ndapota RFQ .