HDI bhodhi , high density interconnect bhodhi redunhu rakadhindwa
HDI mabhodhi ndeimwe yeanokurumidza kukura matekinoroji muPCBs uye ave kuwanikwa muABIS Circuits Ltd.
HDI mabhodhi ane mapofu uye/kana akavigwa vias, uye kazhinji ane mamicrovias e0.006 kana diki dhayamita.Vane yakakwirira redunhu density pane zvechinyakare redunhu mabhodhi.
Kune 6 mhando dzakasiyana dze HDI PCB mabhodhi , kubva pamusoro kusvika pamusoro kuburikidza nemakomba, nemakomba akavigwa uye kuburikidza nemakomba, maviri kana anopfuura HDI akaturikidzana ane kuburikidza nemakomba, passive substrates pasina magetsi ekubatanidza, achishandisa layer pairs The alternating structure of the coreless structure and the coreless structure inoshandisa layer pairs.
Yakadhindwa redunhu bhodhi ine HDI tekinoroji Consumer Driven Technology Iyo in-pad kuburikidza nemaitiro inotsigira akawanda matekinoroji pamatanho mashoma, zvichiratidza kuti hombe haisi nguva dzose iri nani.Kubva mukupera kwema1980s, takaona macamcorder achishandisa inoveli-saizi inki cartridges, akatetepa kuti akwane muchanza cheruoko rwako.Nharembozha komputa uye kushanda kumba kune imwe tekinoroji yepamusoro, ichiita kuti makomputa akurumidze uye akareruka, achibvumira vatengi kushanda vari kure kubva chero kupi. HDI tekinoroji ndicho chikonzero chikuru chekuchinja uku.Chigadzirwa chine mamwe mabasa, kureruka kurema uye vhoriyamu diki.Midziyo yakakosha, zvidiki-zvimiro uye zvitete zvinhu zvinogonesa zvigadzirwa zvemagetsi kudzikira muhukuru panguva yekuwedzera tekinoroji, mhando uye kumhanya. Vias mune pad process Kufemerwa kubva kumusoro kwepamusoro tekinoroji mukupera kwema1980 kwasundidzira miganhu yeBGA, COB, uye CSP kune diki diki inch.Iyo in-pad kuburikidza nemaitiro inobvumira vias kuti iiswe pamusoro peiyo flat pad.Iwo kuburikidza nemakomba akaputirwa uye akazadzwa ne conductive kana isiri-conductive epoxy, yobva yavharwa nekuputirwa kuti isaonekwe. Zvinonzwika zviri nyore, asi zvinotora avhareji yematanho masere ekuwedzera kupedzisa iyi yakasarudzika maitiro.Zvishandiso zvehunyanzvi uye matekinoroji akanyatso dzidziswa vanonyatso tarisisa maitiro ekuita zvakakwana zvakavanzika kuburikidza nemakomba. Kuburikidza nekuzadza mhando Kune akawanda akasiyana marudzi e kuburikidza-gomba rekuzadza zvinhu: isiri-conductive epoxy, conductive epoxy, mhangura-yakazadzwa, sirivheri-yakazadzwa, uye electrochemical plating.Izvi zvichaita kuti maburi akavigwa munzvimbo yakati sandara atengeswe zvachose kune yakajairika.Kudhirowa, bofu kana kuvigwa vias, kuzadza, kuputira uye kuhwanda pasi peSMT pads.Kugadzira rudzi urwu rwekuburikidza negomba kunoda midziyo yakakosha uye inotora nguva.Multiple drilling cycles uye inodzorwa kudzika kuchera inowedzera kugadzirisa nguva. Inodhura-inoshanda HDI Kunyangwe saizi yezvimwe zvigadzirwa zvevatengi zvadzikira, hunhu huchiri hunonyanya kukosha mutengi mushure memutengo.Uchishandisa HDI tekinoroji mukugadzira, iyo 8-layer kuburikidza-gomba PCB inogona kudzikiswa kuita 4-layer HDI micro-hole tekinoroji package PCB.Iyo wiring kugona kweyakanyatsogadzirwa HDI 4-layer PCB inogona kuita zvakafanana kana zvirinani mabasa seyakajairwa 8-layer PCB. Kunyangwe iyo microvia process inowedzera mutengo weHDI PCB, dhizaini chaiyo uye kudzikiswa kwehuwandu hwematanho kunogona kuderedza zvakanyanya mutengo wemamita masendimita ezvinyorwa uye huwandu hwematanho. Vaka mabhodhi asina kujairika eHDI Kubudirira kugadzirwa kweHDI PCB kunoda midziyo yakakosha uye maitiro, senge laser drilling, plugging, laser direct imaging, uye inoenderera mberi lamination cycles.HDI bhodhi mutsara wakatetepa, nzvimbo idiki, mhete yakaomarara, uye yakatetepa yakakosha zvinhu inoshandiswa.Kuti ubudirire kugadzira rudzi urwu rwebhodhi, nguva yekuwedzera uye mari yakawanda mukugadzira maitiro uye michina inodiwa. Laser kuchera tekinoroji Kuboora madiki madiki-maburi anobvumira mamwe matekiniki kuti ashandiswe pamusoro pedunhu redunhu.Uchishandisa danda rine dhayamita remamicron 20 (1 mil), danda iri rine simba guru rinogona kupinda nesimbi nemagirazi kuita tudiki nepaburi.Zvigadzirwa zvitsva zvakabuda, senge yakaderera-kurasikirwa laminates uye yunifomu magirazi emidziyo ine yakaderera dielectric constants.Zvishandiso izvi zvine kukwirira kwekupisa kwekusangana-isina lead uye zvinobvumidza kushandiswa kwemakomba madiki. HDI bhodhi lamination uye zvinhu Yepamberi multilayer tekinoroji inobvumira vagadziri kuti vawedzere mamwe mapeji akateedzana kuti vagadzire multilayer PCB.Kushandisa laser drill kugadzira maburi mukati memukati inobvumira plating, kufungidzira, uye etching usati wadzvanya.Iyi nzira yekuwedzera inonzi sequential kuvaka.SBU kugadzira inoshandisa yakasimba-yakazadzwa vias kubvumira iri nani yekupisa manejimendi 
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