ʻO ka mea i komo i loko o ka papa kaapuni paʻi ( PCB ) ʻoihana hoʻomaopopo i nā PCB i hoʻopau keleawe ma ko lākou ʻili.Inā waiho ʻole ʻia lākou a laila e oxidize ke keleawe a e hōʻino ʻia, e hoʻohana ʻole ai ka papa kaapuni.Hoʻokumu ka hoʻopau ʻili i kahi pilina koʻikoʻi ma waena o ka ʻāpana a me ka PCB.ʻElua mau hana koʻikoʻi ka hoʻopau ʻana, no ka pale ʻana i ke kaapuni keleawe i ʻike ʻia a me ka hāʻawi ʻana i kahi ʻili solderable i ka wā e hui pū ai (kuʻi) i nā ʻāpana i ka papa kaapuni paʻi.

HASL / Lead Free HASL

ʻO HASL ka hoʻopau ʻana o ka ʻili i hoʻohana ʻia ma ka ʻoihana.ʻO ke kaʻina hana, ʻo ka hoʻoinu ʻana i nā papa kaapuni i loko o ka ipu hoʻoheheʻe ʻia o ke kīpē a me ka wehe ʻana i ka solder keu me ka hoʻohana ʻana i nā 'air knives', e puhi ana i ka ea wela ma ka ʻili o ka papa.

ʻO kekahi o nā pōmaikaʻi i manaʻo ʻole ʻia o ke kaʻina HASL, ʻo ia ka mea e hōʻike ai i ka PCB i nā mahana a hiki i 265 ° C e ʻike pono ai i nā pilikia delamination ma mua o ka hoʻopili ʻana i nā mea waiwai i ka papa.

HASL Pa'i Papa Kaapuni Kaapuni Papalua

Pono:

• Kumukuai Haahaa
• Loaʻa ākea
• Hiki ke hana hou
• ʻO ke ola papa maikaʻi loa

Nā hemahema:

• Nā ʻili like ʻole
• ʻAʻole maikaʻi no ka Pitch maikaʻi
• Loaʻa iā Lead (HASL)
• Puka wela
• Hoʻopili ʻia ʻo Solder Bridging
• Nā PTH i hoʻopaʻa ʻia a i hoʻemi ʻia (Plated Through Holes)

Tin Immersion

Wahi a IPC, ʻo ka Association Connecting Electronics Industry, Immersion Tin (ISn) he hoʻopau metala i waiho ʻia e kahi hopena hoʻoneʻe kemika i hoʻopili pololei ʻia ma luna o ke kumu metala o ka papa kaapuni, ʻo ia hoʻi, ke keleawe.Mālama ka ISn i ke keleawe i lalo mai ka hoʻohāhā ʻana ma luna o kona ola i manaʻo ʻia.

ʻO ke keleawe a me ka tin akā naʻe he pili ikaika kekahi i kekahi.ʻO ka laha ʻana o kekahi metala i loko o kekahi metala e hiki mai ana, e pili pono ana i ke ola o ka waihona a me ka hana o ka pau ʻana.Hōʻike maikaʻi ʻia nā hopena maikaʻi ʻole o ka ulu ʻana o ka ʻumi ʻumi ma ka ʻoihana a me nā kumuhana o kekahi mau pepa i paʻi ʻia.

Pono:

• Ili palahalaha
• ʻAʻole Pb
• Hiki ke hana hou
• ʻO ke koho kiʻekiʻe no ka hoʻokomo ʻana i ka Press Fit Pin

Nā hemahema:

• Maʻalahi e hana i ka pōʻino
• Hoʻohana ka Kaʻina i kahi Carcinogen (Thiourea)
• Hiki ke ho'opō'ino 'ia ke kinona i hō'ike 'ia ma ka Hui Hope
• Nā ʻUhiʻi Tini
• ʻAʻole maikaʻi no nā kaʻina hana hou / hui
• Paʻakikī ke ana i ka mānoanoa

Kālā Kaiapuni

ʻO ke kālā Immersion he mea hoʻopau kemika non-electrolytic i hoʻohana ʻia e ka hoʻokomo ʻana i ka PCB keleawe i loko o kahi pahu o nā ion kālā.He hoʻopau koho maikaʻi ia no nā papa kaapuni me ka pale EMI a hoʻohana ʻia no nā pilina dome a me ka hoʻopaʻa ʻana i ke kelepona.ʻO ka mānoanoa ili o ke kālā he 5-18 microinches.

Me nā hopohopo kaiapuni o kēia wā e like me RoHS a me WEE, ʻoi aku ka maikaʻi o ke kālā immersion ma mua o HASL a me ENIG.He mea kaulana ia ma muli o kona kumu kūʻai haʻahaʻa ma mua o ENIG.

Pono:

• Hoʻohana like ʻia ma mua o HASL
• ʻOi aku ka maikaʻi o ke kaiapuni ma mua o ENIG a me HASL
• E like me ka HASL
• ʻOi aku ka maikaʻi ma mua o ENIG

Nā hemahema:

• Pono e kūʻai ʻia i loko o ka lā i wehe ʻia ai ka PCB mai ka waiho ʻana
• Hiki ke hoʻopōʻino maʻalahi me ka mālama pono ʻole
• ʻAʻole ʻoi aku ka lōʻihi ma mua o ka ENIG no ka loaʻa ʻole o kahi papa nickel ma lalo

OSP / Entek

Mālama ʻo OSP (Organic Solderability Preservative) a i ʻole anti-tarnish i ka ʻili keleawe mai ka oxidation ma o ka hoʻohana ʻana i kahi ʻāpana pale lahilahi loa o nā mea ma luna o ke keleawe i hōʻike ʻia me ka hoʻohana pinepine ʻana i kahi kaʻina conveyorized.

Hoʻohana ʻo ia i kahi mea hoʻohui wai i hoʻopaʻa ʻia i ke keleawe a hāʻawi i kahi papa organometallic e pale ai i ke keleawe ma mua o ke kūʻai ʻana.He ʻōmaʻomaʻo ʻōmaʻomaʻo nō hoʻi ia i ka hoʻohālikelike ʻia me nā mea hoʻopau kepau-noa ʻē aʻe, e pilikia ana i ka ʻona a i ʻole ka hoʻohana ʻana i ka ikehu.

Pono:

• Ili palahalaha
• ʻAʻole Pb
• Kaʻina hana maʻalahi
• Hiki ke hana hou
• Kūʻai maikaʻi

Nā hemahema:

• ʻAʻohe ala e ana i ka mānoanoa
• ʻAʻole maikaʻi no ka PTH (Plated Through Holes)
• Ola Pokole
• Hiki ke hana i nā pilikia ICT
• Hōʻike ʻia ʻo Cu ma ka ʻaha hope
• Hoʻopaʻa paʻa

Gula Immersion Nickel Uila ʻole (ENIG)

ENIG mea he elua papa metala uhi o 2-8 μin Au ma luna o 120-240 μin Ni.ʻO ka Nickel ka pale i ke keleawe a ʻo ia ka ʻili kahi i kūʻai maoli ʻia ai nā ʻāpana.Mālama ke gula i ka nickel i ka wā e mālama ai a hāʻawi pū i ke kūpaʻa pili haʻahaʻa e pono ai no nā waihona gula lahilahi.ʻO ENIG i kēia manawa ka mea i hoʻohana nui ʻia i ka ʻoihana PCB ma muli o ka ulu ʻana a me ka hoʻokō ʻana o ka hoʻoponopono RoHs.

Papa Kaapuni Pa'i me Chem Gold Ile Ho'opau

Pono:

• Ili palahalaha
• ʻAʻole Pb
• Maikaʻi no PTH (Plated Through Holes)
• Ke Ola Loa

Nā hemahema:

• Pipiʻi
• ʻAʻole hiki ke hana hou
• Papa ʻEleʻele / Nikela ʻEleʻele
• Poino mai ET
• Nalo ka hōʻailona (RF)
• Kaʻina Paʻakikī

Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)

ʻO ENEPIG, kahi mea hou i ka papa kaapuni honua o ka hoʻopau ʻana, i hele mua ma ka mākeke i ka hopena o 90s.Hāʻawi kēia ʻāpana metala ʻekolu o ka nickel, palladium, a me ke gula i kahi koho e like me nā mea ʻē aʻe: hiki ke hoʻopaʻa ʻia.ʻO ka māhā mua o ENEPIG ma kahi papa kaapuni paʻi i paʻi ʻia me ka hana ʻana ma muli o ke kumu kūʻai kiʻekiʻe loa o ka palladium a me ke koi haʻahaʻa o ka hoʻohana.

ʻAʻole i loaʻa ka pono no kahi laina hana ʻokoʻa no kēia mau kumu like.I kēia mau lā, ua hoʻi hou ʻo ENEPIG ma muli o ka hiki ke hoʻokō i ka hilinaʻi, nā pono o ka pahu, a me nā kūlana RoHS he mea hoʻohui me kēia hoʻopau.He kūpono ia no nā noi alapine kiʻekiʻe kahi i kaupalena ʻia ka spacing.

Ke hoʻohālikelike ʻia me nā hoʻopau ʻehā ʻē aʻe, ʻo ENIG, Lead Free-HASL, kālā kaiapuni a me OSP, ʻoi aku ka maikaʻi o ENEPIG i nā mea a pau ma ka pae ʻino ma hope o ka hui.

Pono:

• Ili palahalaha loa
• ʻAʻohe mea alakaʻi
• Hui Hui Pū ʻIa Nui
• Nā Hui Kūʻai maikaʻi loa
• Uea Bondable
• ʻAʻohe Pilikia ʻino
• 12 mahina a ʻoi aku paha ke ola o ka mālama ʻana
• ʻAʻohe Pilikia Pad ʻeleʻele

Nā hemahema:

• ʻOi aʻe ke kumu kūʻai
• Hiki ke hana hou me kekahi mau palena
• Nā palena hoʻoponopono

Gula – Gula paʻa

ʻO ka Hard Electrolytic Gold kahi papa gula i uhi ʻia ma luna o kahi kapa pale nickel.Paʻa loa ke gula paʻa, a hoʻohana pinepine ʻia i nā wahi ʻaʻahu kiʻekiʻe e like me nā manamana lima hoʻohui lihi a me nā kī.

ʻAʻole e like me ENIG, hiki ke ʻokoʻa kona mānoanoa ma ka hoʻomalu ʻana i ka lōʻihi o ka pōʻai plating, ʻoiai ʻo nā koina liʻiliʻi maʻamau no nā manamana lima he 30 μin gula ma luna o 100 μin nickel no ka Papa 1 a me ka Papa 2, 50 μin gula ma luna o 100 μin nickel no ka Papa 3.

ʻAʻole hoʻohana pinepine ʻia ke gula paʻa i nā wahi hiki ke hoʻopaʻa ʻia, no ka nui o ke kumukūʻai a me ka maikaʻi ʻole o ka solderability.ʻO ka mānoanoa kiʻekiʻe loa i manaʻo ʻia he solderable IPC he 17.8 μin, no laila, inā pono e hoʻohana ʻia kēia ʻano gula ma luna o nā mea e hoʻopaʻa ʻia, ʻo ka mānoanoa nominal i manaʻo ʻia e pili ana i 5-10 μin.

Pono:

• Ili Paʻa Paʻa
• ʻAʻole Pb
• Ke Ola Loa

Nā hemahema:

• Pipiʻi loa
• Hoʻoponopono ʻokoʻa / Koʻikoʻi hana
• Hoʻohana i ka Resist / Tape
• Pono ʻia nā pā paʻi / Bus
• Hoʻokaʻawale
• Paʻakikī me nā hoʻopau ʻili ʻē aʻe
• Hiki i ka Etching Undercut ke alakaʻi i ka Slivering / Flaking
• ʻAʻole hiki ke kūʻai ʻia ma luna o 17 μin
• ʻAʻole e hoʻopili piha ka hoʻopau ʻana i nā ʻaoʻao ʻaoʻao, koe wale nō ma nā wahi manamana

Ke ʻimi nei i kahi hoʻopau ʻili kūikawā no kāu papa kaapuni?