Item NO.:
ABIS-HDI -004Layer:
4Material:
High TG fr-4Finished Board Thickness:
1.0mmFinished Copper thickness:
1ozMin Line Width/Space:
≥3mil(0.075mm)Min Hole:
≥4mil(0.1mm)Surface Finish:
ENIGSolder Mask Color:
GreenLegend Color:
BlackApplication:
Consumer ElectronicsHDI PCB Introduction
HDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.
Where does the resin material come from in ABIS?
Most of them from Shengyi Technology Co., Ltd. (SYTECH), who has been the world's second largest CCL manufacturer in terms of sales volume, from 2013 to 2017. We established long-term relations of cooperation since 2006. The FR4 resin material (Model S1000-2, S1141, S1165, S1600) are mainly used for making single and double-sided printed circuit boards as well as multi-layer boards. Here comes details for your reference.
Rigid PCB Manufacturing Capacity
ABIS experienced in making special materials for rigid PCB, such as: CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. Below is a brief overview FYI.
Item |
Speci. |
Layers |
1~20 |
Board Thickness |
0.1mm-8.0mm |
Material |
FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc |
Max Panel Size |
600mm×1200mm |
Min Hole Size |
0.1mm |
Min Line Width/Space |
3mil(0.075mm) |
Board Outline Tolerance |
士0.10mm |
Insulation Layer Thickness |
0.075mm--5.00mm |
Out Layer Copper Thickness |
18um--350um |
Drilling Hole (Mechanical) |
17um--175um |
Finish Hole (Mechanical) |
0.10mm--6.30mm |
Diameter Tolerance (Mechanical) |
0.05mm |
Registration (Mechanical) |
0.075mm |
Aspect Ratio |
16:1 |
Solder Mask Type |
LPI |
SMT Mini. Solder Mask Width |
0.075mm |
Mini. Solder Mask Clearance |
0.05mm |
Plug Hole Diameter |
0.25mm--0.60mm |
Impedance Control Tolerance |
士10% |
Surface finish |
ENIG, OSP, HASL, Chem. Tin/Sn, Flash Gold |
Soldermask |
Green/Yellow/Black/White/Red/Blue |
Silkscreen |
Red/Yellow/Black/White |
Certificate |
UL, ISO 9001, ISO14001, IATF16949 |
Special Request |
Blind hole, Gold finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating, Half holes |
Material Suppilers |
Shengyi, ITEQ, Taiyo, etc. |
Common Package |
Vacuum+Carton |
PCB Manufacturing Process
- The process starts with designing Layout of the PCB using any PCB designing software / CAD Tool (Proteus, Eagle, Or CAD).
- All rest of the steps are of Manufacturing Process of a Rigid Printed Circuit Board is same as Single Sided PCB or Double Sided PCB or Multi-layer PCB.
PCB Lead Time
Category | Q/T Lead time | Standard Lead Time | Mass Production | |||
|
||||||
Double Sided | 24hrs | 3-4 working days | 8-15 working days | |||
|
||||||
4 Layers | 48hrs | 3-5 working days | 10-15 working days | |||
|
||||||
6 Layers | 72hrs | 3-6 working days | 10-15 working days | |||
|
||||||
8 Layers | 96hrs | 3-7 working days | 14-18 working days | |||
|
||||||
10 Layers | 120hrs | 3-8 working days | 14-18 working days | |||
|
||||||
12 Layers | 120hrs | 3-9 working days | 20-26 working days | |||
|
||||||
14 Layers | 144hrs | 3-10 working days | 20-26 working days | |||
|
||||||
16-20 Layers | Depends on the specific requirements | |||||
|
||||||
20+ Layers | Depends on the specific requirements |
-Hole Preparation
Removing debris carefully & adjusting drill machine parameters: before plating through with copper, abis pays high attention to all holes on an fr4 pcb treated to remove debris, surface irregularities, and epoxy smear, the clean holes ensure the plating successfully adheres to the hole walls. also, early in the process, drill machine parameters are adjusted accurately.
- Surface Preparation
Deburring carefully: our experienced tech workers will be aware ahead of time that the only way to avoid a bad outcome is to anticipate the need for special handling and to take the appropriate steps to be sure that the process is done carefully and correctly.
-Thermal Expansion Rates
Accustomed to dealing with the various materials, abis will be able to analyze the combination to be sure that it is appropriate. then keeping the long-term reliability of the cte (coefficient of thermal expansion), with the lower cte, the less likely the plated through holes are to fail from repeated flexing of the copper which forms the internal layer interconnections.
-Scaling
Abis control the circuitry is scaled-up by known percentages in anticipation of this loss so that the layers will return to their as-designed dimensions after the lamination cycle is complete. also, using the laminate manufacturer’s baseline scaling recommendations in combination with in-house statistical process control data, to dial-in scale factors that will be consistent over time within that particular manufacturing environment.
-Machining
When the time comes to build your pcb, abis be sure that you choose has the right equipment and experience to produce it correctly on the first try.
Packaging & Delivery
ABIS CIRCUITS Company is not only trying to give customers a good product, but also pay attention to offering a complete and safe package. Also, we prepare some personalized services for all the orders.
-Common packaging:
-Delivery Tips:
Business Terms
-Accepted Delivery Terms
FOB, CIF, EXW, FCA, CPT, DDP, DDU, Express Delivery, DAF
--Accepted Payment Currency
USD, EUR, CNY.
-Accepted Payment Type
T/T, PayPal, Western Union.
Quotation from ABIS
To ensure an accurate quote, be sure to include the following information for your project:
Please keep us informed for any interests!
ABIS cares every your order even 1 piece!
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